RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | PGA |
| 包装说明 | CAVITY DOWN, PGA-447 |
| 针数 | 447 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | 8 PIPELINE STAGES; CACHE COHERENCY |
| 地址总线宽度 | 64 |
| 位大小 | 64 |
| 边界扫描 | YES |
| 最大时钟频率 | 67 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FLOATING POINT |
| 集成缓存 | NO |
| JESD-30 代码 | S-CPGA-P447 |
| JESD-609代码 | e0 |
| 长度 | 52.324 mm |
| 低功率模式 | NO |
| DMA 通道数量 | |
| 外部中断装置数量 | 2 |
| 串行 I/O 数 | |
| 端子数量 | 447 |
| 片上数据RAM宽度 | |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | SPGA447,39X39 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 0 |
| 速度 | 67 MHz |
| 最大压摆率 | 2400 mA |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 52.324 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| IDT79RV4400MC-67G447 | IDT79RV4400MC-50G447 | IDT79RV4400MC-75G447 | IDT79RV4400PC-50G | IDT79RV4400PC-67G | IDT79RV4400PC-75G | IDT79RV4400SC-50G447 | IDT79RV4400SC-67G447 | IDT79RV4400SC-75G447 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447 | RISC Microprocessor, 64-Bit, 50MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447 | RISC Microprocessor, 64-Bit, 75MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447 | RISC Microprocessor, 64-Bit, 50MHz, CMOS, CPGA179, CAVITY DOWN, PGA-179 | RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA179, CAVITY DOWN, PGA-179 | RISC Microprocessor, 64-Bit, 75MHz, CMOS, CPGA179, CAVITY DOWN, PGA-179 | RISC Microprocessor, 64-Bit, 50MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447 | RISC Microprocessor, 64-Bit, 67MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447 | RISC Microprocessor, 64-Bit, 75MHz, CMOS, CPGA447, CAVITY DOWN, PGA-447 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | PGA | PGA | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| 包装说明 | CAVITY DOWN, PGA-447 | CAVITY DOWN, PGA-447 | PGA, SPGA447,39X39 | CAVITY DOWN, PGA-179 | CAVITY DOWN, PGA-179 | CAVITY DOWN, PGA-179 | CAVITY DOWN, PGA-447 | CAVITY DOWN, PGA-447 | CAVITY DOWN, PGA-447 |
| 针数 | 447 | 447 | 447 | 179 | 179 | 179 | 447 | 447 | 447 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | 8 PIPELINE STAGES; CACHE COHERENCY | 8 PIPELINE STAGES; CACHE COHERENCY | 150 MIPS; 8 PIPELINE STAGES; CACHE COHERENCY | 8 PIPELINE STAGES | 8 PIPELINE STAGES | 150 MIPS; 8 PIPELINE STAGES | 8 PIPELINE STAGES | 8 PIPELINE STAGES | 150 MIPS; 8 PIPELINE STAGES |
| 地址总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 位大小 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 67 MHz | 50 MHz | 75 MHz | 50 MHz | 67 MHz | 75 MHz | 50 MHz | 67 MHz | 75 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-CPGA-P447 | S-CPGA-P447 | S-CPGA-P447 | S-CPGA-P179 | S-CPGA-P179 | S-CPGA-P179 | S-CPGA-P447 | S-CPGA-P447 | S-CPGA-P447 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 52.324 mm | 52.324 mm | 52.324 mm | 47.244 mm | 47.244 mm | 47.244 mm | 52.324 mm | 52.324 mm | 52.324 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部中断装置数量 | 2 | 2 | 2 | 7 | 7 | 7 | 2 | 2 | 2 |
| 端子数量 | 447 | 447 | 447 | 179 | 179 | 179 | 447 | 447 | 447 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | PGA | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
| 封装等效代码 | SPGA447,39X39 | SPGA447,39X39 | SPGA447,39X39 | PGA179,18X18 | PGA179,18X18 | PGA179,18X18 | SPGA447,39X39 | SPGA447,39X39 | SPGA447,39X39 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 速度 | 67 MHz | 50 MHz | 75 MHz | 50 MHz | 67 MHz | 75 MHz | 50 MHz | 67 MHz | 75 MHz |
| 最大压摆率 | 2400 mA | 2000 mA | 2800 mA | 2000 mA | 2400 mA | 2800 mA | 2000 mA | 2400 mA | 2800 mA |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 52.324 mm | 52.324 mm | 52.324 mm | 47.244 mm | 47.244 mm | 47.244 mm | 52.324 mm | 52.324 mm | 52.324 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | - | - | - | 含铅 | 含铅 | 含铅 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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