IDT79R302016J概述

Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68

IDT79R302016J规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	LCC
包装说明	PLASTIC, LCC-68
针数	68
Reach Compliance Code	not_compliant
JESD-30 代码	S-PQCC-J68
JESD-609代码	e0
长度	24.2062 mm
内存密度	64 bit
内存集成电路类型	MEMORY CIRCUIT
内存宽度	8
湿度敏感等级	1
功能数量	1
端子数量	68
字数	8 words
字数代码	8
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	8X8
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装等效代码	LDCC68,1.0SQ
封装形状	SQUARE
封装形式	CHIP CARRIER
电源	5 V
认证状态	Not Qualified
座面最大高度	4.57 mm
最大压摆率	0.05 mA
最大供电电压 (Vsup)	5.25 V
最小供电电压 (Vsup)	4.75 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn85Pb15)
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
宽度	24.2062 mm

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IDT79R302016J相似产品对比

	IDT79R302016J	IDT79R302016G	IDT79R302020G	IDT79R302020J	IDT79R302025G	IDT79R302025J	IDT79R302033G	IDT79R302033J	IDT79R302040J	IDT79R302040G
描述	Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68	Memory Circuit, 8X8, CMOS, CPGA68, PGA-68	Memory Circuit, 8X8, CMOS, CPGA68, PGA-68	Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68	Memory Circuit, 8X8, CMOS, CPGA68, PGA-68	Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68	Memory Circuit, 4X36, CMOS, CPGA68, PGA-68	Memory Circuit, 4X36, CMOS, PQCC68, PLASTIC, LCC-68	Memory Circuit, 4X36, CMOS, PQCC68, PLASTIC, LCC-68	Memory Circuit, 4X36, CMOS, CPGA68, PGA-68
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	LCC	PGA	PGA	LCC	PGA	LCC	PGA	LCC	LCC	PGA
包装说明	PLASTIC, LCC-68	PGA-68	PGA-68	PLASTIC, LCC-68	PGA-68	PLASTIC, LCC-68	PGA-68	PLASTIC, LCC-68	PLASTIC, LCC-68	PGA-68
针数	68	68	68	68	68	68	68	68	68	68
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 代码	S-PQCC-J68	S-CPGA-P68	S-CPGA-P68	S-PQCC-J68	S-CPGA-P68	S-PQCC-J68	S-CPGA-P68	S-PQCC-J68	S-PQCC-J68	S-CPGA-P68
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	24.2062 mm	29.464 mm	29.464 mm	24.2062 mm	29.464 mm	24.2062 mm	29.464 mm	24.2062 mm	24.2062 mm	29.464 mm
内存密度	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	144 bit	144 bit	144 bit	144 bit
内存集成电路类型	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	8	8	8	8	8	8	36	36	36	36
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	68	68	68	68	68	68	68	68	68	68
字数	8 words	8 words	8 words	8 words	8 words	8 words	4 words	4 words	4 words	4 words
字数代码	8	8	8	8	8	8	4	4	4	4
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	8X8	8X8	8X8	8X8	8X8	8X8	4X36	4X36	4X36	4X36
封装主体材料	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCJ	PGA	PGA	QCCJ	PGA	QCCJ	PGA	QCCJ	QCCJ	PGA
封装等效代码	LDCC68,1.0SQ	PGA68,11X11	PGA68,11X11	LDCC68,1.0SQ	PGA68,11X11	LDCC68,1.0SQ	PGA68,11X11	LDCC68,1.0SQ	LDCC68,1.0SQ	PGA68,11X11
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER	GRID ARRAY	GRID ARRAY	CHIP CARRIER	GRID ARRAY	CHIP CARRIER	GRID ARRAY	CHIP CARRIER	CHIP CARRIER	GRID ARRAY
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	4.57 mm	5.207 mm	5.207 mm	4.57 mm	5.207 mm	4.57 mm	5.207 mm	4.57 mm	4.57 mm	5.207 mm
最大压摆率	0.05 mA	0.05 mA	0.06 mA	0.06 mA	0.07 mA	0.07 mA	0.08 mA	0.08 mA	0.09 mA	0.09 mA
最大供电电压 (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
最小供电电压 (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	NO	YES	NO	YES	NO	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)
端子形式	J BEND	PIN/PEG	PIN/PEG	J BEND	PIN/PEG	J BEND	PIN/PEG	J BEND	J BEND	PIN/PEG
端子节距	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	QUAD	PERPENDICULAR	PERPENDICULAR	QUAD	PERPENDICULAR	QUAD	PERPENDICULAR	QUAD	QUAD	PERPENDICULAR
宽度	24.2062 mm	29.464 mm	29.464 mm	24.2062 mm	29.464 mm	24.2062 mm	29.464 mm	24.2062 mm	24.2062 mm	29.464 mm

IDT79R302016J

IDT79R302016J概述

IDT79R302016J规格参数

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IDT79R302016J相似产品对比

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