Rectangular Connectors
MCEM Series Metal Shell Edgeboard Connectors
Metal Shell Edge Board
Connectors
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Meets MIL-DTL-55302
performance requirements
Layouts 128 and 184 are QPL
to slash sheets 120, 121,
122 and 123
Connectors are available in
40, 44, 80, 110, 128, 152,
and 184 positions
Utilizes low force twist pins
and our low force sockets.
Mating forces in the 3 to 4
oz. [.83 to 1.11N] range per
contact are typical with low
force pin and low force
socket
Designed for surface
mounting and through-the-
board mounting
Available termination
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Mother board (pin side) —
cactus bend
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Daughter board (socket
side) — coke bottle,
right-angle bend to “A”
or “B” side
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Solder pots, and variety
of other wire terminations
for pin and socket
connectors available at
customer’s request
Two hexagonal polarizing
keys (per MIL-DTL-55302
slash sheet 124) are
provided. Jackscrew
hardware is available. For
programmable keying/
jacking modifications
consult Tyco Electronics
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In addition to the plastic
versions of the 2 piece
edgeboard connectors, a
metal shell assembly is
designed and tooled. The
metal shells are made of
aluminum alloy per QQ-A-
591. The insert material is
Diallyl phthalate,
Polyphenylene sulfide
(Ryton) or Liquid Crystal
Polymer (LCP). The techni-
cal and performance data is
essentially the same as that
shown for the MCDM Series
on page 25. These are
rugged, durable connectors
and are ideal for use in
areas of high density pack-
aging and where frequent
connect and disconnects
are required. Designed
initially for applications in
airborne data recorders,
computers and associated
equipment in navigational
systems. The mother board
connector can be ordered
to fit any pattern on the
circuit board. The units can
also be provided with con-
tacts on .100 [2.54] spacing
which results in .100 [2.54]
grid pattern.
Performance Data
Electrical
Contact Resistance
— The average
mated contact resistance is 4 milliohms,
with a maximum value of 8 milliohms.
The average resistance value at 100
microvolts is 4.8 milliohms.
Dielectric Withstanding Voltage
—
800 VAC RMS at sea level (600 for
solder pots); 200 VAC RMS at 70,000
feet [21,336m] (150 for solder pots).
Durability
— Less than the maximum
allowable, 8 milliohms after 500 mating
cycles.
Insulation Resistance
— Greater than
5,000 megohms at room ambient tem-
perature.
Maximum Current Carrying
Capacity
— No. 24 contact 3 amperes.
Mechanical
Contact Engaging & Separation
Forces
— 5.0 oz. max. [1.39N] (eng.),
0.5 oz. min. [.14N] (sep.).
Materials and Finish
Shells
— High grade aluminum alloy,
electroless nickel plated per AMS 2404.
Insulator
— Diallyl Phthalate per MIL-
M-14, Type SDG-F (for 128 & 184);
Polyphenylene Sulfide per MIL-M-
24519 (for 40, 44, 80, 110 & 152), or
Liquid Crystal Polymer per ASTM
D5138.
Contacts
— Pin (low force): beryllium
and OFHC copper, gold plated. Socket
(low force): Copper alloy, gold plated.
Hardware
— Corrosion resistant
stainless steel passivated.
Environmental
Temperature Range
—
-67°F to 302°F [-55° C to +150°C] for
Diallyl Phthalate; -67°F to 257°F [-55°
C to +125°C] for Polyphenylene Sulfide.
Vibration
— No discontinuity in
excess of 1 µ sec. during twelve 20
minute sweeps from 10 to 2000 CPS at
.06 double amplitude or 20 G forces,
whichever is less.
42
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Rectangular Connectors
MCEM Series Metal Shell Edgeboard Connectors
(Continued)
Daughter Board
(Socket Side)
40, 44, 80, 110 &
128
Positions
.071–.076
[1.80–1.93]
2 Plcs.
A
B
Ø
.091–.098
Thru Hole
[2.31–2.49]
2 Plcs.
C’Bore Ø
.187
[4.75] x
.045
[1.14] Deep
(A Side Only)
.250
[6.35]
Ø
.187
Thru 1 Wall
[4.75]
.125
2 Plcs.
[3.18]
B
.060
3 Plcs.
[1.52]
Section B-B
24 AWG
Copper Wire,
Gold Plated
.030
Max.
[0.76]
.150
Min.
[3.81] Solder Dip Typ.
B
.275
[6.99]
.050
Typ.
[1.27]
.250
Max.
[6.35]
.200
±.015
[5.08
± .381
]
.071
Min.
[1.80] at B
.330
[8.38]
2 Plcs.
.180
[4.57]
2 Plcs.
A
Epoxy
Insulator Assy.
Skt. Contact/
Lead Assy.
.250
2 Plcs.
[6.35]
.050
[1.27]
Retaining Pin Holes
4 Plcs.
.050
Typ.
[1.27]
A
B2
B1
Section A-A
Polarizing Key Location
2 Plcs.
A1
A2
Note:
Board thickness .070 [1.78] Max.
Polarizing Key
2 Supplied
(Loose Packed)
Retaining Pin
4 Supplied
(Loose Packed)
How To Specify
S — Solder pots for 26 AWG max.
Z — Wire layout as illustrated.
X — Special, does not fit description below.
MCE
M1
128
L
6
L
4
0.5
Lead Length in Inches (min.)
Insulation Color or Finish
1 — All white wire
2 — All yellow wire
3 — All gray wire
4 — Gold plated
7 — Color coded per
5 — Tin dipped gold plated
MIL-STD-681, System 1
6 — Bare (unfinished)
8 — Special color code
9 — Ten solid color repeating
(starts with black)
G — 19 strand per MIL-C-22759/11
26 AWG, 24 AWG
L — Copper, solid
Q — Stranded per MIL-W-22759/33
Connector Series
Material
M1 — Metal Shell
Layout
40, 44, 80, 110,
128,
152,
184
Contact Type
L — Low Force Pin (Mother Board Connector)
SL — Low Force Socket* (Daughter Board Connector)
Wire Type
*A — Type E, 7 strand
*B — Type ET, 7 strand
*C — Type E, 19 strand
*Per MIL-W-16878
*D — Type ET, 19 strand
F — 7 strand per MIL-C-22759/11
(#28 AWG only)
Wire Size
4–24 AWG
5–25 AWG
6–26 AWG
8–28 AWG
0–30 AWG
Items in bold italic are qualified to MIL-DTL-55302.
Configuration shown is per MIL-DTL-55302/121.
Polarization – Hexagonal hardware is supplied with connector.
Mounting — Standard mounting holes are shown. Consult Tyco Electronics for modifications.
44
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
FPGA/CPLD
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