IDT7026S45J8概述

Multi-Port SRAM, 16KX16, 45ns, CMOS, PQCC84, PLASTIC, LCC-84

IDT7026S45J8规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	LCC
包装说明	QCCJ,
针数	84
Reach Compliance Code	compliant
ECCN代码	EAR99
最长访问时间	45 ns
其他特性	ARBITER; SEMAPHORE
JESD-30 代码	S-PQCC-J84
JESD-609代码	e0
长度	29.2862 mm
内存密度	262144 bit
内存集成电路类型	MULTI-PORT SRAM
内存宽度	16
功能数量	1
端口数量	2
端子数量	84
字数	16384 words
字数代码	16000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	16KX16
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装形状	SQUARE
封装形式	CHIP CARRIER
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
认证状态	Not Qualified
座面最大高度	4.572 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
宽度	29.2862 mm

文档预览

下载PDF文档

全文
预览

IDT7026S45J8相似产品对比

	IDT7026S45J8	IDT7026L45G	IDT7026L45J8	IDT7026L70GB	IDT7026L45J	IDT7026S70GB	IDT7026S45G	IDT7026S45GB	IDT7026S45J	IDT7026L45GB
描述	Multi-Port SRAM, 16KX16, 45ns, CMOS, PQCC84, PLASTIC, LCC-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, PQCC84, PLASTIC, LCC-84	Multi-Port SRAM, 16KX16, 70ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, PQCC84, PLASTIC, LCC-84	Multi-Port SRAM, 16KX16, 70ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, PQCC84, PLASTIC, LCC-84	Multi-Port SRAM, 16KX16, 45ns, CMOS, CPGA84, CAVITY-UP, CERAMIC, PGA-84
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	LCC	PGA	LCC	PGA	LCC	PGA	PGA	PGA	LCC	PGA
包装说明	QCCJ,	CAVITY-UP, CERAMIC, PGA-84	QCCJ,	CAVITY-UP, CERAMIC, PGA-84	QCCJ, LDCC84,1.2SQ	CAVITY-UP, CERAMIC, PGA-84	CAVITY-UP, CERAMIC, PGA-84	CAVITY-UP, CERAMIC, PGA-84	QCCJ, LDCC84,1.2SQ	CAVITY-UP, CERAMIC, PGA-84
针数	84	84	84	84	84	84	84	84	84	84
Reach Compliance Code	compliant	not_compliant	compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	EAR99	EAR99	EAR99	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99	3A001.A.2.C	EAR99	3A001.A.2.C
最长访问时间	45 ns	45 ns	45 ns	70 ns	45 ns	70 ns	45 ns	45 ns	45 ns	45 ns
其他特性	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE	ARBITER; SEMAPHORE
JESD-30 代码	S-PQCC-J84	S-CPGA-P84	S-PQCC-J84	S-CPGA-P84	S-PQCC-J84	S-CPGA-P84	S-CPGA-P84	S-CPGA-P84	S-PQCC-J84	S-CPGA-P84
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	29.2862 mm	27.94 mm	29.2862 mm	27.94 mm	29.2862 mm	27.94 mm	27.94 mm	27.94 mm	29.2862 mm	27.94 mm
内存密度	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
内存集成电路类型	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2	2	2
端子数量	84	84	84	84	84	84	84	84	84	84
字数	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
字数代码	16000	16000	16000	16000	16000	16000	16000	16000	16000	16000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	125 °C	70 °C	125 °C	70 °C	125 °C	70 °C	125 °C
组织	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16	16KX16
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCJ	PGA	QCCJ	PGA	QCCJ	PGA	PGA	PGA	QCCJ	PGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER	GRID ARRAY	CHIP CARRIER	GRID ARRAY	CHIP CARRIER	GRID ARRAY	GRID ARRAY	GRID ARRAY	CHIP CARRIER	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	4.572 mm	5.207 mm	4.572 mm	5.207 mm	4.572 mm	5.207 mm	5.207 mm	5.207 mm	4.572 mm	5.207 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	NO	YES	NO	NO	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY
端子面层	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)
端子形式	J BEND	PIN/PEG	J BEND	PIN/PEG	J BEND	PIN/PEG	PIN/PEG	PIN/PEG	J BEND	PIN/PEG
端子节距	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
端子位置	QUAD	PERPENDICULAR	QUAD	PERPENDICULAR	QUAD	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	QUAD	PERPENDICULAR
宽度	29.2862 mm	27.94 mm	29.2862 mm	27.94 mm	29.2862 mm	27.94 mm	27.94 mm	27.94 mm	29.2862 mm	27.94 mm
是否无铅	含铅	含铅	含铅	含铅	-	含铅	含铅	含铅	-	含铅
峰值回流温度（摄氏度）	225	NOT SPECIFIED	225	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
处于峰值回流温度下的最长时间	30	NOT SPECIFIED	30	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
I/O 类型	-	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
输出特性	-	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装等效代码	-	PGA84M,11X11	-	PGA84M,11X11	LDCC84,1.2SQ	PGA84M,11X11	PGA84M,11X11	PGA84M,11X11	LDCC84,1.2SQ	PGA84M,11X11
电源	-	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V
最大待机电流	-	0.006 A	-	0.012 A	0.006 A	0.035 A	0.018 A	0.035 A	0.018 A	0.012 A
最小待机电流	-	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
最大压摆率	-	0.35 mA	-	0.395 mA	0.35 mA	0.47 mA	0.41 mA	0.48 mA	0.41 mA	0.41 mA

IDT7026S45J8

IDT7026S45J8概述

IDT7026S45J8规格参数

文档预览

IDT7026S45J8相似产品对比

推荐资源