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Datasheet> 器件分类 > 存储> 存储> HYB18T1G800AF-3.7

HYB18T1G800AF-3.7: 产品描述DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68; 产品类别存储存储; 文件大小3MB，共53页; 制造商QIMONDA; 标准

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HYB18T1G800AF-3.7概述

DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68

HYB18T1G800AF-3.7规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	QIMONDA
零件包装代码	BGA
包装说明	TFBGA, BGA68,9X19,32
针数	68
Reach Compliance Code	unknown
ECCN代码	EAR99
访问模式	MULTI BANK PAGE BURST
最长访问时间	0.5 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	267 MHz
I/O 类型	COMMON
交错的突发长度	4,8
JESD-30 代码	R-PBGA-B68
JESD-609代码	e1
长度	20 mm
内存密度	1073741824 bit
内存集成电路类型	DDR DRAM
内存宽度	8
湿度敏感等级	3
功能数量	1
端口数量	1
端子数量	68
字数	134217728 words
字数代码	128000000
工作模式	SYNCHRONOUS
最高工作温度	95 °C
最低工作温度
组织	128MX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA68,9X19,32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
电源	1.8 V
认证状态	Not Qualified
刷新周期	8192
座面最大高度	1.2 mm
自我刷新	YES
连续突发长度	4,8
最大供电电压 (Vsup)	1.9 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	10 mm

HYB18T1G800AF-3.7相似产品对比

	HYB18T1G800AF-3.7	HYB18T1G400AF-3S	HYB18T1G160AF-3.7	HYB18T1G800AF-5	HYB18T1G800AFL-3.7	HYB18T1G400AF-3.7	HYB18T1G160AF-5	HYB18T1G400AFL-3.7	HYB18T1G400AF-5	HYB18T1G800AF-3S
描述	DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 256MX4, 0.45ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 64MX16, 0.5ns, CMOS, PBGA92, ROHS COMPLIANT, PLASTIC, TFBGA-92	DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 256MX4, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 64MX16, 0.6ns, CMOS, PBGA92, ROHS COMPLIANT, PLASTIC, TFBGA-92	DDR DRAM, 256MX4, 0.5ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 256MX4, 0.6ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68	DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, ROHS COMPLIANT, PLASTIC, TFBGA-68
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TFBGA, BGA68,9X19,32	TFBGA, BGA68,9X19,32	TFBGA, BGA92,9X21,32	TFBGA, BGA68,9X19,32	TFBGA, BGA68,9X19,32	TFBGA, BGA68,9X19,32	TFBGA, BGA92,9X21,32	TFBGA, BGA68,9X19,32	TFBGA, BGA68,9X19,32	TFBGA, BGA68,9X19,32
针数	68	68	92	68	68	68	92	68	68	68
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
最长访问时间	0.5 ns	0.45 ns	0.5 ns	0.6 ns	0.5 ns	0.5 ns	0.6 ns	0.5 ns	0.6 ns	0.45 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	267 MHz	333 MHz	267 MHz	200 MHz	266 MHz	267 MHz	200 MHz	266 MHz	200 MHz	333 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
交错的突发长度	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
JESD-30 代码	R-PBGA-B68	R-PBGA-B68	R-PBGA-B92	R-PBGA-B68	R-PBGA-B68	R-PBGA-B68	R-PBGA-B92	R-PBGA-B68	R-PBGA-B68	R-PBGA-B68
长度	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
内存密度	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	8	4	16	8	8	4	16	4	4	8
湿度敏感等级	3	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1	1
端子数量	68	68	92	68	68	68	92	68	68	68
字数	134217728 words	268435456 words	67108864 words	134217728 words	134217728 words	268435456 words	67108864 words	268435456 words	268435456 words	134217728 words
字数代码	128000000	256000000	64000000	128000000	128000000	256000000	64000000	256000000	256000000	128000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C	95 °C
组织	128MX8	256MX4	64MX16	128MX8	128MX8	256MX4	64MX16	256MX4	256MX4	128MX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
封装等效代码	BGA68,9X19,32	BGA68,9X19,32	BGA92,9X21,32	BGA68,9X19,32	BGA68,9X19,32	BGA68,9X19,32	BGA92,9X21,32	BGA68,9X19,32	BGA68,9X19,32	BGA68,9X19,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260	260
电源	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	8192	8192	8192	8192	8192	8192	8192	8192	8192	8192
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
连续突发长度	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8	4,8
最大供电电压 (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	40	40	40	40	40	40	40	40	40	40
宽度	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
厂商名称	QIMONDA	-	-	-	-	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA
Base Number Matches	-	1	1	1	1	1	1	-	-	-

HYB18T1G800AF-3.7

HYB18T1G800AF-3.7概述

HYB18T1G800AF-3.7规格参数

HYB18T1G800AF-3.7相似产品对比

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