CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL24,.4 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 其他特性 | TTL COMPATIBLE BUS SWITCH |
| 系列 | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-GDFP-F24 |
| 长度 | 14.36 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS EXCHANGER |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 4 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 传播延迟(tpd) | 1.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.29 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 9.09 mm |
| SN54CBT3383W | SN74CBT3383NT | SN54CBT3383JT | SN54CBT3383WR | SN74CBT3383DB | SN74CBT3383DBLE | SN74CBT3383PWLE | SN74CBT3383DGV | |
|---|---|---|---|---|---|---|---|---|
| 描述 | CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24 | CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, PDIP24 | CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, CDIP24, CERAMIC, DIP-24 | CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, CDFP24, CERAMIC, FP-24 | CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, PDSO24 | 10-Bit FET Bus-Exchange Switches 24-SSOP -40 to 85 | 10-Bit FET Bus-Exchange Switches 24-TSSOP -40 to 85 | CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, PDSO24, TVSOP-24 |
| 包装说明 | DFP, FL24,.4 | DIP, DIP24,.3 | DIP, DIP24,.3 | DFP, | SSOP, | SSOP, SSOP24,.3 | TSSOP, TSSOP24,.25 | TSSOP, |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknown | not_compliant | not_compliant | unknown |
| 其他特性 | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH; MAX RON = 12 OHM @ VIN = 2.4V & ION = 15MA | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH |
| 系列 | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-GDFP-F24 | R-PDIP-T24 | R-GDIP-T24 | R-GDFP-F24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| 长度 | 14.36 mm | 31.64 mm | 32.005 mm | 14.36 mm | 8.2 mm | 8.2 mm | 7.8 mm | 5 mm |
| 逻辑集成电路类型 | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER |
| 位数 | 10 | 10 | 10 | 10 | 10 | 2 | 2 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 5 | 5 | 1 |
| 端口数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DFP | DIP | DIP | DFP | SSOP | SSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟(tpd) | 1.5 ns | 0.25 ns | 1.5 ns | 1.5 ns | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.29 mm | 5.08 mm | 5.08 mm | 2.29 mm | 2 mm | 2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.4 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 9.09 mm | 7.62 mm | 7.62 mm | 9.09 mm | 5.3 mm | 5.3 mm | 4.4 mm | 4.4 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP | - | DIP | DFP | - | SSOP | TSSOP | SOIC |
| 针数 | 24 | - | 24 | 24 | - | 24 | 24 | 24 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | - |
| 封装等效代码 | FL24,.4 | DIP24,.3 | DIP24,.3 | - | - | SSOP24,.3 | TSSOP24,.25 | - |
| 电源 | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | - |
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