SRAM Module, 256KX9, 10ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DIP |
| 包装说明 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 |
| 针数 | 44 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 10 ns |
| 其他特性 | TTL COMPATIBLE INPUTS/OUTPUTS |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-PDIP-T44 |
| JESD-609代码 | e0 |
| 长度 | 86.36 mm |
| 内存密度 | 2359296 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX9 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP44,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 9.398 mm |
| 最大待机电流 | 0.27 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 1.71 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| IDT7MB4040S10P | IDT7MB4040S20P | IDT7MB4040S15P | IDT7MB4040S12P | IDT7MB4040S17P | IDT7MB4040S25P | IDT7MB4040S35P | |
|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 256KX9, 10ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | SRAM Module, 256KX9, 20ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | SRAM Module, 256KX9, 15ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | SRAM Module, 256KX9, 12ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | SRAM Module, 256KX9, 17ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | SRAM Module, 256KX9, 25ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | SRAM Module, 256KX9, 35ns, CMOS, PDIP44, 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 | 3.400 X 0.600 INCH, 0.350 INCH HEIGHT, PLASTIC, DIP-44 |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 10 ns | 20 ns | 15 ns | 12 ns | 17 ns | 25 ns | 35 ns |
| 其他特性 | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDIP-T44 | R-PDIP-T44 | R-PDIP-T44 | R-PDIP-T44 | R-PDIP-T44 | R-PDIP-T44 | R-PDIP-T44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 86.36 mm | 86.36 mm | 86.36 mm | 86.36 mm | 86.36 mm | 86.36 mm | 86.36 mm |
| 内存密度 | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit | 2359296 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 | 256KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP44,.6 | DIP44,.6 | DIP44,.6 | DIP44,.6 | DIP44,.6 | DIP44,.6 | DIP44,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 9.398 mm | 9.398 mm | 9.398 mm | 9.398 mm | 9.398 mm | 9.398 mm | 9.398 mm |
| 最大待机电流 | 0.27 A | 0.27 A | 0.27 A | 0.27 A | 0.27 A | 0.27 A | 0.27 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 1.71 mA | 1.44 mA | 1.44 mA | 1.44 mA | 1.44 mA | 1.44 mA | 1.44 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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