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IDT54FCT16373ATEB

产品描述Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48
产品类别逻辑    逻辑   
文件大小134KB,共7页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT54FCT16373ATEB概述

Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48

IDT54FCT16373ATEB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码DFP
包装说明DFP, FL48,.4,25
针数48
Reach Compliance Codenot_compliant
系列FCT
JESD-30 代码R-GDFP-F48
JESD-609代码e0
长度15.875 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.048 A
位数8
功能数量2
端口数量2
端子数量48
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性TRUE
封装主体材料CERAMIC, GLASS-SEALED
封装代码DFP
封装等效代码FL48,.4,25
封装形状RECTANGULAR
封装形式FLATPACK
峰值回流温度(摄氏度)225
电源5 V
Prop。Delay @ Nom-Sup5.6 ns
传播延迟(tpd)9.8 ns
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
座面最大高度2.413 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式FLAT
端子节距0.635 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度9.652 mm

文档预览

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IDT54/74FCT16373T/AT/CT
FAST CMOS 16-BIT TRANSPARENT LATCH
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
FAST CMOS 16-BIT
TRANSPARENT LATCH
IDT54/74FCT16373T/AT/CT
FEATURES:
0.5 MICRON CMOS Technology
High-speed, low-power CMOS replacement for ABT functions
Typical t
SK
(o) (Output Skew) < 250ps
Low input and output leakage
≤1µ
A (max.)
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
V
CC
= 5V ±10%
High drive outputs (-32mA I
OH
, 64mA I
OL
)
Power off disable outputs permit “live insertion”
Typical V
OLP
(Output Ground Bounce) < 1.0V at V
CC
= 5V, T
A
=
25°C
Available in the following packages:
Industrial: SSOP, TSSOP, TVSOP
Military: CERPACK
DESCRIPTION:
The FCT16373T 16-bit transparent D-type latch is built using advanced
dual metal CMOS technology. These high-speed, low-power latches are
ideal for temporary storage of data. They can be used for implementing
memory address latches, I/O ports, and bus drivers. The Output Enable and
Latch Enable controls are organized to operate each device as two 8-bit
latches, or one 16-bit latch. Flow-through organization of signal pins
simplifies layout. All inputs are designed with hysteresis for improved noise
margin.
The FCT16373T is ideally suited for driving high-capacitance loads and
low-impedance backplanes. The output buffers are designed with power off
disable capability to allow "live insertion" of boards when used as backplane
drivers.
FUNCTIONAL BLOCK DIAGRAM
1
OE
2
OE
1
LE
1
D
1
2
LE
D
1
O
1
2
D
1
D
2
O
1
C
C
TO SEVEN OTHER CHANNELS
TO SEVEN OTHER CHANNELS
MILITARY AND INDUSTRIAL TEMPERATURE RANGES
1
c
1999 Integrated Device Technology, Inc.
NOVEMBER 2000
DSC-5454/-

IDT54FCT16373ATEB相似产品对比

IDT54FCT16373ATEB IDT54FCT16373CTE IDT54FCT16373CTEB IDT54FCT16373ATE IDT54FCT16373TE
描述 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48 Bus Driver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP48, 0.025 INCH PITCH, CERPACK-48
零件包装代码 DFP DFP DFP DFP DFP
包装说明 DFP, FL48,.4,25 DFP, DFP, FL48,.4,25 DFP, DFP,
针数 48 48 48 48 48
Reach Compliance Code not_compliant unknown not_compliant unknown unknown
系列 FCT FCT FCT FCT FCT
JESD-30 代码 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48 R-GDFP-F48
JESD-609代码 e0 e0 e0 e0 e0
长度 15.875 mm 15.875 mm 15.875 mm 15.875 mm 15.875 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 8 8 8 8 8
功能数量 2 2 2 2 2
端口数量 2 2 2 2 2
端子数量 48 48 48 48 48
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 DFP DFP DFP DFP DFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
传播延迟(tpd) 9.8 ns 8 ns 8 ns 9.8 ns 15 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.413 mm 2.413 mm 2.413 mm 2.413 mm 2.413 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD
端子形式 FLAT FLAT FLAT FLAT FLAT
端子节距 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
宽度 9.652 mm 9.652 mm 9.652 mm 9.652 mm 9.652 mm
厂商名称 IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
其他特性 - POWER OFF DISABLE O/P'S; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS - POWER OFF DISABLE O/P\'S; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS POWER OFF DISABLE O/P\'S; TYP VOLP < 1V @ VCC = 5V, TA = 25 DEGREE C; MAX OUTPUT SKEW = 0.5NS
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