IC 16K X 4 STANDARD SRAM, 10 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
包装说明 | DFP, FL28,.5,30 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 10 ns |
I/O 类型 | SEPARATE |
JESD-30 代码 | R-GDFP-F28 |
JESD-609代码 | e0 |
长度 | 13.67 mm |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
负电源额定电压 | -5.2 V |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 28 |
字数 | 16384 words |
字数代码 | 16000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 75 °C |
最低工作温度 | |
组织 | 16KX4 |
输出特性 | OPEN-EMITTER |
可输出 | NO |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装等效代码 | FL28,.5,30 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | -5.2 V |
认证状态 | Not Qualified |
座面最大高度 | 2.286 mm |
最大压摆率 | 0.24 mA |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 0.762 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.69 mm |
NM10494F10 | NM10494D10 | NM10494F15 | NM10494D12 | NM10494F12 | NM10494D15 | |
---|---|---|---|---|---|---|
描述 | IC 16K X 4 STANDARD SRAM, 10 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM | IC 16K X 4 STANDARD SRAM, 10 ns, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Static RAM | IC 16K X 4 STANDARD SRAM, 15 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM | IC 16K X 4 STANDARD SRAM, 12 ns, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Static RAM | IC 16K X 4 STANDARD SRAM, 12 ns, CDFP28, 0.762 MM PITCH, CERPACK-28, Static RAM | IC 16K X 4 STANDARD SRAM, 15 ns, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Static RAM |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
包装说明 | DFP, FL28,.5,30 | DIP, DIP28,.4 | DFP, FL28,.5,30 | DIP, DIP28,.4 | DFP, FL28,.5,30 | DIP, DIP28,.4 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 10 ns | 10 ns | 15 ns | 12 ns | 12 ns | 15 ns |
I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 代码 | R-GDFP-F28 | R-CDIP-T28 | R-GDFP-F28 | R-CDIP-T28 | R-GDFP-F28 | R-CDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi | 65536 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
负电源额定电压 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
可输出 | NO | NO | NO | NO | NO | NO |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DIP | DFP | DIP | DFP | DIP |
封装等效代码 | FL28,.5,30 | DIP28,.4 | FL28,.5,30 | DIP28,.4 | FL28,.5,30 | DIP28,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.286 mm | 4.191 mm | 2.286 mm | 4.191 mm | 2.286 mm | 4.191 mm |
最大压摆率 | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA | 0.24 mA |
表面贴装 | YES | NO | YES | NO | YES | NO |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
端子节距 | 0.762 mm | 2.54 mm | 0.762 mm | 2.54 mm | 0.762 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.69 mm | 10.16 mm | 10.69 mm | 10.16 mm | 10.69 mm | 10.16 mm |
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