Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DFP |
| 包装说明 | 0.635 MM PITCH, CERPACK-56 |
| 针数 | 56 |
| Reach Compliance Code | compliant |
| 其他特性 | SYNCHRONOUS O/P ENABLES; COMMON CLOCK ENABLE FOR EACH REGISTER; BUS HOLD I/PS |
| 系列 | FCT |
| JESD-30 代码 | R-GDFP-F56 |
| JESD-609代码 | e3 |
| 长度 | 18.415 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS EXCHANGER |
| 位数 | 12 |
| 功能数量 | 1 |
| 端口数量 | 3 |
| 端子数量 | 56 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 5.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.413 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | FLAT |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 9.652 mm |
| IDT74FCT162H272CTEG | IDT74FCT162H272CTPFG | IDT74FCT162H272ATEG | IDT74FCT162H272ATPFG | IDT74FCT162H272ETPFG | IDT74FCT162H272ETEG | |
|---|---|---|---|---|---|---|
| 描述 | Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56 | Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56 | Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56 | Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56 | Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, PDSO56, 0.40 MM PITCH, TVSOP-56 | Bus Exchanger, FCT Series, 1-Func, 12-Bit, True Output, CMOS, CDFP56, 0.635 MM PITCH, CERPACK-56 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | DFP | SSOP | DFP | SSOP | SSOP | DFP |
| 包装说明 | 0.635 MM PITCH, CERPACK-56 | 0.40 MM PITCH, TVSOP-56 | 0.635 MM PITCH, CERPACK-56 | 0.40 MM PITCH, TVSOP-56 | 0.40 MM PITCH, TVSOP-56 | 0.635 MM PITCH, CERPACK-56 |
| 针数 | 56 | 56 | 56 | 56 | 56 | 56 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-GDFP-F56 | R-PDSO-G56 | R-GDFP-F56 | R-PDSO-G56 | R-PDSO-G56 | R-GDFP-F56 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 18.415 mm | 11.3 mm | 18.415 mm | 11.3 mm | 11.3 mm | 18.415 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER | BUS EXCHANGER |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 56 | 56 | 56 | 56 | 56 | 56 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | TSSOP | DFP | TSSOP | TSSOP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 5.4 ns | 5.4 ns | 6 ns | 6 ns | 5 ns | 5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.413 mm | 1.2 mm | 2.413 mm | 1.2 mm | 1.2 mm | 2.413 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | Matte Tin (Sn) - annealed | MATTE TIN | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | MATTE TIN |
| 端子形式 | FLAT | GULL WING | FLAT | GULL WING | GULL WING | FLAT |
| 端子节距 | 0.635 mm | 0.4 mm | 0.635 mm | 0.4 mm | 0.4 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 9.652 mm | 4.4 mm | 9.652 mm | 4.4 mm | 4.4 mm | 9.652 mm |
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