IDT74ALVC16260
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH
INDUSTRIAL TEMPERATURE RANGE
3.3V CMOS 12-BIT TO
24-BIT MULTIPLEXED
D-TYPE LATCH WITH
3-STATE OUTPUTS
• 0.5 MICRON CMOS Technology
• Typical t
SK(o)
(Output Skew) < 250ps
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• V
CC
= 3.3V ± 0.3V, Normal Range
• V
CC
= 2.7V to 3.6V, Extended Range
• V
CC
= 2.5V ± 0.2V
• CMOS power levels (0.4µ W typ. static)
µ
• Rail-to-Rail output swing for increased noise margin
• Available in SSOP, TSSOP, and TVSOP packages
IDT74ALVC16260
FEATURES:
DESCRIPTION:
DRIVE FEATURES:
• High Output Drivers: ±24mA
• Suitable for heavy loads
APPLICATIONS:
• 3.3V high speed systems
• 3.3V and lower voltage computing systems
This 12-bit to 24-bit multiplexed D-type latch is built using advanced dual
metal CMOS technology. The ALVC16260 is used in applications in which
two separate data paths must be multiplexed onto, or demultiplexed from,
a single data path. Typical applications include multiplexing and/or demultiplexing
address and data information in microprocessor or bus-interface applica-
tions. This device also is useful in memory interleaving applications.
Three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-2B12) are avail-
able for address and/or data transfer. The output-enable (OE2B,
OE2B,
and
OEA)
inputs control the bus transceiver functions. The
OE2B
and
OE2B
control signals also allow bank control in the A-to-B direction. Address and/
or data information can be stored using the internal storage latches. The
latch-enable (LE1B, LE2B, LEA1B, and LEA2B) inputs are used to control
data storage. When the latch-enable input is high, the latch is transparent.
When the latch-enable input goes low, the data present at the inputs is
latched and remains latched until the latch-enable input is returned high.
The ALVC16260 has been designed with a ±24mA output driver. This
driver is capable of driving a moderate to heavy load while maintaining
speed performance.
FUNCTIONAL BLOCK DIAGRAM
OE1B
LEA1B
29
30
A-1B
LATCH
12
1
B
1:12
LE1B
SEL
OEA
2
12
28
1
1B-A
LATCH
12
12
A
1:12
12
M
U
X
1
0
12
12
LE2B
27
2B-A
LATCH
12
LEA2B
OE2B
55
A-2B
LATCH
2
B
1:12
12
56
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
© 1999 Integrated Device Technology, Inc.
MARCH 1999
DSC-4536/2
IDT74ALVC16260
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH
INDUSTRIAL TEMPERATURE RANGE
PIN CONFIGURATION
O EA
LE1B
2
B
3
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Description
Max
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
OE2B
LEA2B
2
B
4
Unit
V
V
°C
mA
mA
mA
mA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
TERM
(2)
Terminal Voltage with Respect to GND
V
TERM
(3)
Terminal Voltage with Respect to GND
T
STG
I
OUT
I
IK
I
OK
I
CC
I
SS
Storage Temperature
DC Output Current
Continuous Clamp Current,
V
I
< 0 or V
I
> V
CC
Continuous Clamp Current, V
O
< 0
Continuous Current through each
V
CC
or GND
–0.5 to +4.6
–0.5 to V
CC
+0.5
–65 to +150
–50 to +50
±50
–50
±100
GND
2
B
2
2
B
1
GND
2
B
5
2
B
6
V
CC
A
1
A
2
A
3
GND
A
4
A
5
A
6
A
7
A
8
A
9
GND
A
10
A
11
A
12
V
CC
1
B
1
1
B
2
V
CC
2
B
7
2
B
8
2
B
9
GND
2
B
10
2
B
11
2
B
12
1
B
12
1
B
11
1
B
10
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. V
CC
terminals.
3. All terminals except V
CC
.
CAPACITANCE
(T
A
= +25°C, F = 1.0MHz)
Symbol
C
IN
C
OUT
C
OUT
Parameter
(1)
Input Capacitance
Output Capacitance
I/O Port Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
V
IN
= 0V
Typ.
5
7
7
Max.
7
9
9
Unit
pF
pF
pF
GND
1
B
9
1
B
8
1
B
7
NOTE:
1. As applicable to the device type.
V
CC
1
B
6
1
B
5
GND
1
B
3
GND
1
B
4
FUNCTION TABLES
(1)
B-TO-A (OEB = H)
Inputs
1Bx
H
2Bx
X
SEL
H
LE1B
H
LE2B
X
OEA
L
Output
Ax
H
LE2B
SEL
LEA1B
OE1B
SSOP/ TSSOP/ TVSOP
TOP VIEW
L
X
X
X
X
X
X
X
H
L
X
X
H
H
L
L
L
X
H
L
X
X
X
X
X
X
H
H
L
X
L
L
L
L
L
H
L
A
0
(2)
H
L
A
0
(2)
Z
2
IDT74ALVC16260
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH
INDUSTRIAL TEMPERATURE RANGE
FUNCTION TABLES
(CONTINUED)
(1)
A-TO-B (OEA = H)
Inputs
Ax
H
L
H
L
H
L
X
X
X
X
X
LEA1B
H
H
H
H
L
L
L
X
X
X
X
LEA2B
H
H
L
L
H
H
L
X
X
X
X
OE1B
L
L
L
L
L
L
L
H
L
H
L
OE2B
L
L
L
L
L
L
L
H
H
L
L
H
L
H
L
1B
0
1B
0
1B
0
Z
Active
Z
Active
(2)
(2)
(2)
Outputs
1Bx
2Bx
H
L
2B
0
2B
0
(2)
(2)
H
L
2B
0
Z
Z
Active
Active
(2)
NOTES:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
Z = High Impedance
↑
= LOW-to-HIGH transition
2. Output level before the indicated steady-state input conditions were established.
PIN DESCRIPTION
Pin Names
Ax
(1:12)
1Bx
(1:12)
2Bx
(1:12)
LEA1B
LEA2B
LE1B
LE2B
SEL
OEA
OE1B
OE2B
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
Description
Bidirectional Data Port A. Usually connected to the CPU's address/data bus.
Bidirectional Data Port 1B. Usually connected to the even path or even bank of memory.
Bidirectional Data Port 2B. Usually connected to the odd path or odd bank of memory.
Latch Enable Input for A-1B Latch. The latch is open when LEA1B is HIGH. Data from the A-port is latched on the HIGH to LOW
transition of LEA1B
Latch Enable Input for A-2B Latch. The latch is open when LEA2B is HIGH. Data from the A-port is latched on the HIGH to LOW
transition of LEA2B
Latch Enable Input for 1B-A Latch. The latch is open when LE1B is HIGH. Data from the A-port is latched on the HIGH to LOW
transition of LE1B
Latch Enable Input for 2B-A Latch. The latch is open when LE2B is HIGH. Data from the A-port is latched on the HIGH to LOW
transition of LE2B
1B or 2B Port Selection. When HIGH, SEL enables data transfer from 1B Port to A Port. When LOW, SEL enables data transfer from
2B Port to A Port.
Output Enable for A Port (Active LOW)
Output Enable for 1B Port (Active LOW)
Output Enable for 2B Port (Active LOW)
3
IDT74ALVC16260
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH
INDUSTRIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: T
A
= –40°C to +85°C
Symbol
V
IH
V
IL
I
IH
I
IL
I
OZH
I
OZL
V
IK
V
H
I
CCL
I
CCH
I
CCZ
∆I
CC
Parameter
Input HIGH Voltage Level
Input LOW Voltage Level
Input HIGH Current
Input LOW Current
High Impedance Output Current
(3-State Output pins)
Clamp Diode Voltage
Input Hysteresis
Quiescent Power Supply Current
V
CC
= 2.3V, I
IN
= –18mA
V
CC
= 3.3V
V
CC
= 3.6V
V
IN
= GND or V
CC
One input at V
CC
- 0.6V, other inputs at V
CC
or GND
V
CC
= 2.3V to 2.7V
V
CC
= 2.7V to 3.6V
V
CC
= 2.3V to 2.7V
V
CC
= 2.7V to 3.6V
V
CC
= 3.6V
V
CC
= 3.6V
V
CC
= 3.6V
V
I
= V
CC
V
I
= GND
V
O
= V
CC
V
O
= GND
Test Conditions
Min.
1.7
2
—
—
—
—
—
—
—
—
—
Typ.
(1)
—
—
—
—
—
—
—
—
–0.7
100
0.1
Max.
—
—
0.7
0.8
±5
±5
±10
±10
–1.2
—
40
V
mV
µA
µA
µA
µA
V
Unit
V
Quiescent Power Supply Current
Variation
—
—
750
µA
NOTE:
1. Typical values are at V
CC
= 3.3V, +25°C ambient.
OUTPUT DRIVE CHARACTERISTICS
Symbol
V
OH
Parameter
Output HIGH Voltage
V
CC
= 2.3V
V
CC
= 2.3V
V
CC
= 2.7V
V
CC
= 3V
V
CC
= 3V
V
OL
Output LOW Voltage
V
CC
= 2.3V to 3.6V
V
CC
= 2.3V
V
CC
= 2.7V
V
CC
= 3V
I
OH
= – 24mA
I
OL
= 0.1mA
I
OL
= 6mA
I
OL
= 12mA
I
OL
= 12mA
I
OL
= 24mA
Test Conditions
(1)
V
CC
= 2.3V to 3.6V
I
OH
= – 0.1mA
I
OH
= – 6mA
I
OH
= – 12mA
Min.
V
CC
– 0.2
2
1.7
2.2
2.4
2
—
—
—
—
—
Max.
—
—
—
—
—
—
0.2
0.4
0.7
0.4
0.55
V
Unit
V
NOTE:
1. V
IH
and V
IL
must be within the min. or max. range shown in the DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE table for the appropriate V
CC
range.
T
A
= – 40°C to + 85°C.
4
IDT74ALVC16260
3.3V CMOS 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH
INDUSTRIAL TEMPERATURE RANGE
OPERATING CHARACTERISTICS, T
A
= 25°C
V
CC
= 2.5V ± 0.2V
Symbol
C
PD
C
PD
Parameter
Power Dissipation Capacitance Outputs enabled
Power Dissipation Capacitance Outputs disabled
Test Conditions
C
L
= 0pF, f = 10Mhz
Typical
37
4
V
CC
= 3.3V ± 0.3V
Typical
41
7
Unit
pF
SWITCHING CHARACTERISTICS
(1)
V
CC
= 2.5V ± 0.2V
Symbol
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
SU
t
H
t
W
t
SK(O)
Parameter
Propagation Delay
Ax to 1Bx or Ax to 2Bx
Propagation Delay
1Bx to Ax or 2Bx to Ax
Propagation Delay
LEXB to Ax
Propagation Delay
LE1B to 1BX or LEA2B to 2Bx
Propagation Delay
SEL to Ax
Output Enable Time
OEA
to Ax,
OE1B
to 1Bx, or
OE2B
to 2Bx
Output Disable Time
OEA
to Ax,
OE1B
to 1Bx, or
OE2B
to 2Bx
Set-up Time, data before LE1B, LE2B, LEA1B, LEA2B
Hold Time, data after LE1B, LE2B, LEA1B, LEA2B
Pulse Duration, LE1B, LE2B, LEA1B, or LEA2B HIGH
Output Skew
(2)
1.4
1.1
3.3
—
—
—
—
—
1.1
1.9
3.3
—
—
—
—
—
1.1
1.5
3.3
—
—
—
—
500
ns
ns
ns
ps
1
5.7
—
5
1.3
4.6
ns
1
6.7
—
6.4
1
5.4
ns
1
6.9
—
6.6
1.1
5.6
ns
1
5.6
—
5.2
1
4.4
ns
1
5.6
—
5.2
1
4.4
ns
1
5.4
—
5.1
1.2
4.3
ns
Min.
1
Max.
5.4
—
V
CC
= 2.7V
Min.
Max.
5.1
V
CC
= 3.3V ± 0.3V
Min.
1.2
Max.
4.3
Unit
ns
NOTES:
1. See TEST CIRCUITS AND WAVEFORMS. T
A
= – 40°C to + 85°C.
2. Skew between any two outputs of the same package and switching in the same direction.
5
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