OT PLD, 50ns, TTL, CQCC28, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大时钟频率 | 13.3 MHz |
| JESD-30 代码 | S-CQCC-N28 |
| 专用输入次数 | 12 |
| I/O 线路数量 | 4 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 12 DEDICATED INPUTS, 4 I/O |
| 输出函数 | MIXED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 50 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |

| PAL20R4A-2ML/883B | PAL20R8A-2MJS/883B | PAL20R6A-2ML/883B | PAL20R4A-2MJS/883B | PAL20R8A-2ML/883B | |
|---|---|---|---|---|---|
| 描述 | OT PLD, 50ns, TTL, CQCC28, CERAMIC, LCC-28 | OT PLD, 25ns, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24 | OT PLD, 50ns, TTL, CQCC28, CERAMIC, LCC-28 | OT PLD, 50ns, TTL, CDIP24, 0.300 INCH, SKINNY, CERAMIC, DIP-24 | OT PLD, 25ns, TTL, CQCC28, CERAMIC, LCC-28 |
| 零件包装代码 | QLCC | DIP | QLCC | DIP | QLCC |
| 包装说明 | QCCN, | DIP, | QCCN, | DIP, | QCCN, |
| 针数 | 28 | 24 | 28 | 24 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大时钟频率 | 13.3 MHz | 13.3 MHz | 13.3 MHz | 13.3 MHz | 13.3 MHz |
| JESD-30 代码 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 |
| 专用输入次数 | 12 | 12 | 12 | 12 | 12 |
| I/O 线路数量 | 4 | - | 2 | 4 | - |
| 端子数量 | 28 | 24 | 28 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 12 DEDICATED INPUTS, 4 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 2 I/O | 12 DEDICATED INPUTS, 4 I/O | 12 DEDICATED INPUTS, 0 I/O |
| 输出函数 | MIXED | REGISTERED | MIXED | MIXED | REGISTERED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | QCCN | DIP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 50 ns | 25 ns | 50 ns | 50 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD |
| 厂商名称 | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics |
| 是否无铅 | - | 不含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 不符合 |
| 峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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