OT PLD, 6.5ns, TTL, PQCC20, PLASTIC, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | POWER-UP RESET; REGISTER PRELOAD; 1 EXTERNAL CLOCK |
| 最大时钟频率 | 117 MHz |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e0 |
| 长度 | 8.9662 mm |
| 专用输入次数 | 8 |
| I/O 线路数量 | |
| 端子数量 | 20 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 8 DEDICATED INPUTS, 0 I/O |
| 输出函数 | REGISTERED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 6.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.9662 mm |

| PAL16R8-5JC | 8103610SA | 8103607SA | 81036082A | 8103608SA | 5962-88515032A | |
|---|---|---|---|---|---|---|
| 描述 | OT PLD, 6.5ns, TTL, PQCC20, PLASTIC, LCC-20 | OT PLD, 30 ns, CDFP20, 0.250 X 0.500 INCH, CERPAK-20 | OT PLD, 30 ns, CDFP20, 0.250 X 0.500 INCH, CERPAK-20 | OT PLD, 25 ns, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 | OT PLD, 25 ns, CDFP20, 0.250 X 0.500 INCH, CERPAK-20 | OT PLD, 50 ns, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | QLCC | DFP | DFP | QLCC | DFP | QLCC |
| 包装说明 | QCCJ, | DFP, | DFP, | QCCN, | DFP, | QCCN, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | POWER-UP RESET; REGISTER PRELOAD; 1 EXTERNAL CLOCK | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET | REGISTER PRELOAD; POWER-UP RESET |
| JESD-30 代码 | S-PQCC-J20 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 | S-CQCC-N20 |
| 长度 | 8.9662 mm | 13.0175 mm | 13.0175 mm | 8.89 mm | 13.0175 mm | 8.89 mm |
| 专用输入次数 | 8 | 8 | 10 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 75 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 4 I/O | 10 DEDICATED INPUTS, 6 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 2 I/O |
| 输出函数 | REGISTERED | MIXED | COMBINATORIAL | REGISTERED | REGISTERED | MIXED |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | DFP | DFP | QCCN | DFP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 6.5 ns | 30 ns | 30 ns | 25 ns | 25 ns | 50 ns |
| 认证状态 | Not Qualified | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 座面最大高度 | 4.57 mm | 2.286 mm | 2.286 mm | 2.54 mm | 2.286 mm | 2.54 mm |
| 最大供电电压 | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL EXTENDED | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | FLAT | FLAT | NO LEAD | FLAT | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 8.9662 mm | 6.731 mm | 6.731 mm | 8.89 mm | 6.731 mm | 8.89 mm |
| 最大时钟频率 | 117 MHz | 20 MHz | - | 20 MHz | 20 MHz | 13.3 MHz |
| 端子面层 | Tin/Lead (Sn/Pb) | NOT SPECIFIED | - | - | NOT SPECIFIED | TIN LEAD |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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