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HLS328-01TG

产品描述IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
产品类别连接器    插座   
文件大小195KB,共2页
制造商Advanced Interconnections Corp
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HLS328-01TG概述

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

HLS328-01TG规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性STANDARD: UL 94V-0, LOW PROFILE
主体宽度0.4 inch
主体深度0.165 inch
主体长度1.4 inch
联系完成配合GOLD OVER NICKEL
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BERYLLIUM COPPER ALLOY
触点样式RND PIN-SKT
设备插槽类型IC SOCKET
使用的设备类型DIP28
外壳材料POLYETHYLENE
JESD-609代码e0
制造商序列号HLS
插接触点节距0.1 inch
安装方式STRAIGHT
触点数28
最高工作温度260 °C
最低工作温度-60 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.3 mm
端子节距2.54 mm
端接类型SOLDER

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DIP Sockets
Table of Models
Molded DIP Sockets
Closed Frame and Open Frame
Description:
Closed Frame Socket (RDS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.125
(3.18)
Description:
Open Frame Socket (RLS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.050
(1.27)
*
*
.100/(2.54) for 48 and 60 pos.
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
For more information, refer to the Peel-A-Way
®
DIP Sockets pages (30-31).
RDS replaces DS and HDS.
RLS replaces LS and HLS.
.005
(.13)
Polyimide
Film
Features:
• Multiple finger contact on all
sockets assures maximum
reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• To fit .100/(2.54mm) pitch.
• Easily customized to fit your
application.
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
RDS 3
16 - 01
M
G
Contact Plating
RoHS Compliant:
Body Type
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
RDS - Hi-Temp LCP
Closed Frame Molded
RLS - Hi-Temp LCP
Open Frame Molded
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)*
*Open Frame only
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Number of Pins
Closed Frame 8 - 40
Open Frame 8 - 64
(see table on next page for standard pin counts)
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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