Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Broadcom(博通) |
| 包装说明 | R-CBCC-N4 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 应用 | SWITCHING |
| 最小击穿电压 | 100 V |
| 配置 | SEPARATE, 2 ELEMENTS |
| 最大二极管电容 | 0.3 pF |
| 标称二极管电容 | 0.2 pF |
| 二极管元件材料 | SILICON |
| 最大二极管正向电阻 | 2.5 Ω |
| 二极管电阻测试电流 | 1 mA |
| 二极管电阻测试频率 | 100 MHz |
| 二极管类型 | PIN DIODE |
| 频带 | ULTRA HIGH FREQUENCY |
| JESD-30 代码 | R-CBCC-N4 |
| JESD-609代码 | e3 |
| 少数载流子标称寿命 | 0.2 µs |
| 湿度敏感等级 | 1 |
| 元件数量 | 2 |
| 端子数量 | 4 |
| 最高工作温度 | 150 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 反向测试电压 | 5 V |
| 表面贴装 | YES |
| 技术 | POSITIVE-INTRINSIC-NEGATIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 |
| HMPP-3895-TR1 | HMPP-389T-BLK | HMPP-3890-TR2 | HMPP-3890-TR1 | HMPP-389T-TR1 | HMPP-3890-BLK | HMPP-389T-TR2 | HMPP-3895-BLK | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) |
| 包装说明 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| 最小击穿电压 | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V |
| 配置 | SEPARATE, 2 ELEMENTS | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SEPARATE, 2 ELEMENTS |
| 最大二极管电容 | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF |
| 标称二极管电容 | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF |
| 二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| 最大二极管正向电阻 | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω |
| 二极管电阻测试电流 | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA |
| 二极管电阻测试频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| 二极管类型 | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE |
| 频带 | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY |
| JESD-30 代码 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 少数载流子标称寿命 | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 元件数量 | 2 | 1 | 1 | 1 | 1 | 1 | 1 | 2 |
| 端子数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 反向测试电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
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