Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Broadcom(博通) |
包装说明 | R-CBCC-N4 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
应用 | SWITCHING |
最小击穿电压 | 100 V |
配置 | SINGLE |
最大二极管电容 | 0.3 pF |
标称二极管电容 | 0.2 pF |
二极管元件材料 | SILICON |
最大二极管正向电阻 | 2.5 Ω |
二极管电阻测试电流 | 1 mA |
二极管电阻测试频率 | 100 MHz |
二极管类型 | PIN DIODE |
频带 | ULTRA HIGH FREQUENCY |
JESD-30 代码 | R-CBCC-N4 |
JESD-609代码 | e3 |
少数载流子标称寿命 | 0.2 µs |
湿度敏感等级 | 1 |
元件数量 | 1 |
端子数量 | 4 |
最高工作温度 | 150 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
反向测试电压 | 5 V |
表面贴装 | YES |
技术 | POSITIVE-INTRINSIC-NEGATIVE |
端子面层 | Tin (Sn) |
端子形式 | NO LEAD |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 20 |
HMPP-3890-BLK | HMPP-389T-BLK | HMPP-3890-TR2 | HMPP-3890-TR1 | HMPP-389T-TR1 | HMPP-389T-TR2 | HMPP-3895-BLK | HMPP-3895-TR1 | |
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描述 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 | Pin Diode, 100V V(BR), Silicon, LEADLESS, CERAMIC, ULTRA MINIATURE, 1412, MINIPAK-4 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) | Broadcom(博通) |
包装说明 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
最小击穿电压 | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V |
配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SEPARATE, 2 ELEMENTS | SEPARATE, 2 ELEMENTS |
最大二极管电容 | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF | 0.3 pF |
标称二极管电容 | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF | 0.2 pF |
二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
最大二极管正向电阻 | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω | 2.5 Ω |
二极管电阻测试电流 | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA |
二极管电阻测试频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
二极管类型 | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE |
频带 | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY | ULTRA HIGH FREQUENCY |
JESD-30 代码 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 | R-CBCC-N4 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
少数载流子标称寿命 | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 2 | 2 |
端子数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
反向测试电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE |
端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
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