
Low-Power Dual Buffer/Driver With 3-State Outputs 8-VSSOP -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | VSSOP, TSSOP8,.12,20 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 控制类型 | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 2.3 mm |
| 负载电容(CL) | 30 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.004 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSSOP |
| 封装等效代码 | TSSOP8,.12,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 包装方法 | TR |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 1.2/3.3 V |
| 最大电源电流(ICC) | 0.0009 mA |
| Prop。Delay @ Nom-Su | 25.5 ns |
| 传播延迟(tpd) | 25.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.9 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 宽度 | 2 mm |
| Base Number Matches | 1 |
| SN74AUP2G240DCUR | SN74AUP2G240YFPR | SN74AUP2G240RSER | SN74AUP2G240DQER | |
|---|---|---|---|---|
| 描述 | Low-Power Dual Buffer/Driver With 3-State Outputs 8-VSSOP -40 to 85 | Low-Power Dual Buffer/Driver With 3-State Outputs 8-DSBGA -40 to 85 | Low-Power Dual Buffer/Driver With 3-State Outputs 8-UQFN -40 to 85 | Low-Power Dual Buffer/Driver With 3-State Outputs 8-X2SON -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | BGA | QFN | QFN |
| 包装说明 | VSSOP, TSSOP8,.12,20 | VFBGA, BGA8,2X4,16 | QFN-8 | HSON, SOLCC8,.04,14 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | 6 weeks |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-G8 | R-XBGA-B8 | S-XQCC-N8 | R-PDSO-N8 |
| JESD-609代码 | e4 | e1 | e4 | e4 |
| 长度 | 2.3 mm | 1.57 mm | 1.5 mm | 1.4 mm |
| 负载电容(CL) | 30 pF | 30 pF | 30 pF | 30 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | VSSOP | VFBGA | VQCCN | HSON |
| 封装等效代码 | TSSOP8,.12,20 | BGA8,2X4,16 | LCC8,.06SQ,20 | SOLCC8,.04,14 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG |
| 包装方法 | TR | TR | TR | TR |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
| 电源 | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| 最大电源电流(ICC) | 0.0009 mA | 0.0009 mA | 0.0009 mA | 0.0009 mA |
| Prop。Delay @ Nom-Su | 25.5 ns | 25.5 ns | 19.9 ns | 25.5 ns |
| 传播延迟(tpd) | 25.5 ns | 25.5 ns | 25.5 ns | 25.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.9 mm | 0.5 mm | 0.6 mm | 0.4 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| 端子形式 | GULL WING | BALL | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.4 mm | 0.5 mm | 0.35 mm |
| 端子位置 | DUAL | BOTTOM | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 翻译 | N/A | N/A | N/A | N/A |
| 宽度 | 2 mm | 0.77 mm | 1.5 mm | 1 mm |
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