AND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | AUP |
| Logic Function | AND |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 26.3@1.2V|16.6@1.5V|12.9@1.8V|8.8@2.5V|6.7@3.3V |
| Absolute Propagation Delay Time (ns) | 27 |
| Process Technology | CMOS |
| 输出类型 Output Type | Push-Pull |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 2.5|3.3|1.8 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| 系列 Packaging | Tape and Reel |
| Standard Package Name | SOP |
| Pin Count | 8 |
| Supplier Package | VSSOP |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Length | 2.1(Max) |
| Package Width | 2.4(Max) |
| PCB changed | 8 |
| Lead Shape | Gull-wing |
| SN74AUP2G08DCUR | SN74AUP2G08YZPR | SN74AUP2G08YFPR | SN74AUP2G08RSER | SN74AUP2G08DQER | |
|---|---|---|---|---|---|
| 描述 | AND Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R | Low-Power Dual 2-Input Positive-AND Gate 8-DSBGA -40 to 85 | Low-Power Dual 2-Input Positive-AND Gate 8-DSBGA -40 to 85 | Low-Power Dual 2-Input Positive-AND Gate 8-UQFN -40 to 85 | Low-Power Dual 2-Input Positive-AND Gate 8-X2SON -40 to 85 |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 零件包装代码 | - | BGA | BGA | QFN | QFN |
| 包装说明 | - | VFBGA, BGA8,2X4,20 | VFBGA, BGA8,2X4,16 | HVQCCN, LCC8,.06SQ,20 | VSSOP, SOLCC8,.04,14 |
| 针数 | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | compli | compli | compli | compli |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | - | 1 week | 1 week | 1 week | 6 weeks |
| 系列 | - | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | - | R-XBGA-B8 | R-XBGA-B8 | S-XQCC-N8 | R-PDSO-G8 |
| JESD-609代码 | - | e1 | e1 | e4 | e4 |
| 长度 | - | 1.9 mm | 1.57 mm | 1.5 mm | 1.4 mm |
| 负载电容（CL） | - | 30 pF | 30 pF | 30 pF | 30 pF |
| 逻辑集成电路类型 | - | AND GATE | AND GATE | AND GATE | AND GATE |
| 最大I（ol） | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | 2 | 2 | 2 | 2 |
| 输入次数 | - | 2 | 2 | 2 | 2 |
| 端子数量 | - | 8 | 8 | 8 | 8 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | - | VFBGA | VFBGA | HVQCCN | VSSOP |
| 封装等效代码 | - | BGA8,2X4,20 | BGA8,2X4,16 | LCC8,.06SQ,20 | SOLCC8,.04,14 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| 最大电源电流（ICC） | - | 0.0009 mA | 0.0009 mA | 0.0009 mA | 0.0009 mA |
| Prop。Delay @ Nom-Su | - | 27 ns | 27 ns | 27 ns | 27 ns |
| 传播延迟（tpd） | - | 27 ns | 27 ns | 27 ns | 27 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | NO | NO |
| 座面最大高度 | - | 0.5 mm | 0.5 mm | 0.6 mm | 0.4 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 1.1 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| 端子形式 | - | BALL | BALL | NO LEAD | GULL WING |
| 端子节距 | - | 0.5 mm | 0.4 mm | 0.5 mm | 0.35 mm |
| 端子位置 | - | BOTTOM | BOTTOM | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 0.9 mm | 0.77 mm | 1.5 mm | 1 mm |
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