PARALLEL, WORD INPUT LOADING, 0.004us SETTLING TIME, 12-BIT DAC, PQFP64, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MO-136ACD, TQFP-64
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFP |
包装说明 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MO-136ACD, TQFP-64 |
针数 | 64 |
Reach Compliance Code | unknown |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY |
输入格式 | PARALLEL, WORD |
JESD-30 代码 | S-PQFP-G64 |
JESD-609代码 | e3 |
长度 | 10 mm |
最大线性误差 (EL) | 0.05% |
湿度敏感等级 | 3 |
标称负供电电压 | -5.2 V |
位数 | 12 |
功能数量 | 1 |
端子数量 | 64 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HTFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
认证状态 | COMMERCIAL |
座面最大高度 | 1.2 mm |
标称安定时间 (tstl) | 0.004 µs |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | TIN |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10 mm |
MAX555CCB+D | MAX555CCB-D | MAX555CCB+TD | |
---|---|---|---|
描述 | PARALLEL, WORD INPUT LOADING, 0.004us SETTLING TIME, 12-BIT DAC, PQFP64, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MO-136ACD, TQFP-64 | PARALLEL, WORD INPUT LOADING, 0.004us SETTLING TIME, 12-BIT DAC, PQFP64, 10 X 10 MM, 1 MM HEIGHT, MO-136ACD, TQFP-64 | PARALLEL, WORD INPUT LOADING, 0.004us SETTLING TIME, 12-BIT DAC, PQFP64, 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MO-136ACD, TQFP-64 |
是否无铅 | 含铅 | 不含铅 | 不含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | QFP | QFP | QFP |
包装说明 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MO-136ACD, TQFP-64 | 10 X 10 MM, 1 MM HEIGHT, MO-136ACD, TQFP-64 | 10 X 10 MM, 1 MM HEIGHT, LEAD FREE, MO-136ACD, TQFP-64 |
针数 | 64 | 64 | 64 |
Reach Compliance Code | unknown | unknown | unknown |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY | BINARY | BINARY |
输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
JESD-609代码 | e3 | e0 | e3 |
长度 | 10 mm | 10 mm | 10 mm |
最大线性误差 (EL) | 0.05% | 0.05% | 0.05% |
湿度敏感等级 | 3 | 3 | 3 |
标称负供电电压 | -5.2 V | -5.2 V | -5.2 V |
位数 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 |
最高工作温度 | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HTFQFP | HTFQFP | HTFQFP |
封装形状 | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 245 | 260 |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm |
标称安定时间 (tstl) | 0.004 µs | 0.004 µs | 0.004 µs |
表面贴装 | YES | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN | TIN LEAD | TIN |
端子形式 | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10 mm | 10 mm | 10 mm |
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