IL260 IL261
High Speed Five Channel Digital Couplers
Functional Diagram
Features
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3.3 V or 5 V CMOS/TTL Compatible
110 Mbps Data Rate
2500 V
RMS
Isolation (1 min)
2 ns Typical Pulse Width Distortion
4 ns Typical Propagation Delay Skew
10 ns Typical Propagation Delay
30 kV/ms Typical Transient Immunity
2 ns Channel to Channel Skew
0.3'' and 0.15'' 16–Pin SOIC Packages
Extended Temperature Range (-40°C to +85°C)
UL1577 Approval Pending
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IEC 61010-1 Approval Pending
Applications
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ADCs and DACs
Multiplexed Data Transmission
Data Interfaces
Board-To-Board Communication
Digital Noise Reduction
Operator Interface
Ground Loop Elimination
Peripheral Interfaces
Parallel Bus
Logic Level Shifting
Plasma Displays
Description
NVE's family of high-speed digital isolators are CMOS
devices created by integrating active circuitry and our GMR-
based and patented* IsoLoop® technology. The IL260 and
IL261 are five channel versions of the world's fastest digital
isolator with a 110 Mbps data rate. This device provides the
designer with the most compact isolated logic devices yet
available. All transmit and receive channels operate at 110
Mbps over the full temperature and supply voltage range. The
symmetric magnetic coupling barrier provides a typical
propagation delay of only 10 ns and a pulse width distortion
of 2 ns achieving the best specifications of any isolator device.
Typical transient immunity of 30 kV/µs is unsurpassed. High
channel density make them ideally suited to isolating multiple
ADCs and DACs, parallel buses and peripheral interfaces.
Performance is specified over the temperature range of -40°C
to +85°C without any derating. .
Isoloop® is a registered trademark of NVE Corporation.
*U.S. Patent number 5,831,426; 6,300,617 and others.
ISB-DS-001-IL612-A, January 20, 2005
NVE Corp., 11409 Valley View Road, Eden Prairie, MN 55344-3617, U.S.A.
Telephone: 952-829-9217, Fax 952-829-9189, www.isoloop.com
© 2005 NVE Corporation
IL260 IL261
Absolute Maximum Ratings
Parameters
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Input Voltage
Output Voltage
Output Current
Lead Solder Temperature
ESD
Parameters
T
S
T
A
V
DD
1
,V
DD
2
V
I
V
O
I
O
-55
-55
-0.5
-0.5
-0.5
-10
175
125
7
V
DD
+0.5
V
DD
+0.5
10
280
2 kV Human Body Model
Typ.
Max.
°C
°C
V
V
V
mA
°C
Drive Channel
10 s
Recommended Operating Conditions
Ambient Operating Temperature
Supply Voltage
Supply Voltage
Logic High Input Voltage
Logic Low Input Voltage
Minimum Input Signal Rise and
Fall Times
Insulation Specifications
Parameters
Symbol
Min.
Typ.
Max.
Units
Test Conditions
(1)
Symbol
Min.
Units
Test Conditions
T
A
V
DD
1
,V
DD
2
V
DD
1
,V
DD
2
V
IH
V
IL
t
IR
, t
IF
-40
3.0
4.5
2.4
0
85
5.5
5.5
V
DD
0.8
1
°C
V
V
mA
V
µsec
3.3/5.0 V Operation
5 V Operation
Creepage Distance (external)
0.15'' SOIC
0.30'' SOIC
Leakage Current
(5)
Barrier Impedance
(5)
Safety & Approvals
IEC61010-1
TUV Certificate Numbers:
4.026
8.077
0.2
>10
14
||7
mm
mm
µA
RMS
Ω
|| pC
240 V
RMS
Approval Pending
Classification
Model
IL260, IL261
IL260-3, IL261-3
Package
.30
''
16-pin SOIC
.15
''
16-pin SOIC
Pollution Degree
II
II
Material Group
III
III
Max. Working
Voltage
300 V
RMS
150 V
RMS
UL 1577
Component Recognition program. File #:
Approval Pending
Rated 2500V
RMS
for 1 minute (SOIC, PDIP), 1000V
RMS
for 1 minute (MSOP)
Electrostatic Discharge Sensitivity
This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, NVE recommends that all integrated
circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance
degradation to complete failure.
2
IL260 IL261
IL260 Pin Connections
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
IN
1
GND
1
IN
2
IN
3
IN
4
V
DD1
IN
5
GND
1
GND
2
OUT
5
OUT
4
OUT
3
OUT
2
OUT
1
GND
2
V
DD2
Input 1
Ground
Pins 2 and 8 connected internally
Input 2
Input 3
Input 4
Supply Voltage 1
Input 5
Ground
Pins 2 and 8 connected internally
Ground
Pins 9 and 15 connected internally
Output 5
Output 4
Output 3
Output 2
Output 1
Ground
Pins 9 and 15 connected internally
Supply Voltage 2
IL260
* Pins 2 and 8 internally connected
** Pins 9 and 15 internally connected
IL260 Pin Connections
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
V
DD1
GND
1
IN
1
IN
2
IN
3
IN
4
OUT
5
GND
1
GND
2
IN
5
OUT
4
OUT
3
OUT
2
OUT
1
GND
2
V
DD2
Supply Voltage 1
Ground
Pins 2 and 8 connected internally
Input 1
Input 2
Input 3
Input 4
Output 5
Ground
Pins 2 and 8 connected internally
Ground
Pins 9 and 15 connected internally
Input 5
Output 4
Output 3
Output 2
Output 1
Ground
Pins 9 and 15 connected internally
Supply Voltage 2
IL261
* Pins 2 and 8 internally connected
** Pins 9 and 15 internally connected
3
IL260 IL261
3.3 Volt Electrical Specifications
Electrical Specifications are T
min
to T
max
Parameters
Input Quiescent Current
IL260
IL261
Output Quiescent Current
IL260
IL261
Logic Input Current
Logic High Output Voltage
Logic Low Output Voltage
Symbol
I
DD1
I
DD2
I
i
V
OH
V
OL
-10
V
DD
-0.1
0.8*V
DD
Min.
Typ.
30
1.5
6.5
5.5
Max.
50
2.0
10
8
10
Units
µA
mA
mA
mA
µA
V
V
Test Conditions
Maximum Data Rate
Minimum Pulse Width
Propagation Delay Input to Output
(High to Low)
Propagation Delay Input to Output
(Low to High)
Pulse Width Distortion |t
PHL
-t
PLH
|
(2)
Propagation Delay Skew
(3)
Output Rise Time (10-90%)
Output Fall Time (10-90%)
Common Mode Transient Immunity
(Output Logic High to Logic Low)
(4)
Channel to Channel Skew
Dynamic Power Consumption
(6)
PW
t
PHL
t
PLH
PWD
t
PSK
t
R
t
F
|CM
H
|,|CM
L
|
V
DD
V
DD
-0.5
0
0.5
Switching Specifications
100
110
10
12
12
2
4
2
2
30
2
200
0.1
0.8
I
O
= -20
µA,
V
I
=V
IH
I
O
= -4 mA, V
I
=V
IH
I
O
= 20
µA,
V
I
=V
IL
I
O
= 4 mA, V
I
=V
IL
C
L
= 15 pF
50% Points, V
O
C
L
= 15 pF,
C
L
= 15 pF,
C
L
= 15 pF
C
L
= 15 pF
C
L
= 15 pF
C
L
= 15 pF
V
CN
= 300 V
C
L
= 15 pF
per channel
18
18
3
6
4
4
3
240
Mbps
ns
ns
ns
ns
ns
ns
ns
kV/µs
ns
µA/MHz
20
5 Volt Electrical Specifications
Electrical Specifications are T
min
to T
max
Parameters
Input Quiescent Current
IL260
IL261
Output Quiescent Current
IL260
IL261
Logic Input Current
Logic High Output Voltage
Logic Low Output Voltage
Symbol
I
DD1
I
DD2
I
i
V
OH
V
OL
-10
V
DD
-0.1
0.8*V
DD
Min.
Typ.
30
2.5
10
8
Max.
50
3.0
15
12
10
Units
µA
mA
mA
mA
µA
V
V
Test Conditions
Maximum Data Rate
Minimum Pulse Width
Propagations Delay Input to Output
(High to Low)
Propagations Delay Input to Output
(Low to High)
Pulse Width Distortion |t
PHL
-t
PLH
|
(2)
Propagation Delay Skew
(3)
Output Rise Time (10-90%)
Output Fall Time (10-90%)
Common Mode Transient Immunity
(Output Logic High to Logic Low)
Channel to Channel Skew
Dynamic Power Consumption
(6)
PW
t
PHL
t
PLH
PWD
t
PSK
t
R
t
F
|CM
H
|,|CM
L
|
V
DD
V
DD
-0.5
0
0.5
Switching Specifications
100
110
10
10
10
2
4
1
1
30
2
280
0.1
0.8
I
O
= -20
µA,
V
I
=V
IH
I
O
= -4 mA, V
I
=V
IH
I
O
= 20
µA,
V
I
=V
IL
I
O
= 4 mA, V
I
=V
IL
C
L
= 15 pF
50% Points, V
O
C
L
= 15 pF,
C
L
= 15 pF,
C
L
= 15 pF
C
L
= 15 pF
C
L
= 15 pF
C
L
= 15 pF
V
CN
= 300 V
C
L
= 15 pF
per channel
15
15
3
6
3
3
3
340
Mbps
ns
ns
ns
ns
ns
ns
ns
kV/µs
ns
µA/MHz
20
4
IL260 IL261
Notes:
(Apply to both 3.3 V and 5 V specifications.)
1. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It
does not guarantee performance.
2. PWD is defined as | t
PHL
– t
PLH
|. %PWD is equal to the PWD divided by the pulse width.
3. t
PSK
is equal to the magnitude of the worst case difference in t
PHL
and/or t
PLH
that will be seen between units at 25°C.
4. CM
H
is the maximum common mode voltage slew rate that can be sustained while maintaining V
O
> 0.8 V
DD
. CM
L
is the
maximum common mode input voltage that can be sustained while maintaining V
O
< 0.8 V. The common mode voltage slew
rates apply to both rising and falling common mode voltage edges.
5. Device is considered a two terminal device: pins 1-8 shorted and pins 9-16 shorted.
6. Dynamic power consumption numbers are calculated per channel and are supplied by the channel’s input side power supply.
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