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HYM7V64200CLTZG-10P

产品描述Synchronous DRAM Module, 2MX64, CMOS, GLASS EPOXY, SODIMM-144
产品类别存储    存储   
文件大小261KB,共14页
制造商SK Hynix(海力士)
官网地址http://www.hynix.com/eng/
下载文档 详细参数 选型对比 全文预览

HYM7V64200CLTZG-10P概述

Synchronous DRAM Module, 2MX64, CMOS, GLASS EPOXY, SODIMM-144

HYM7V64200CLTZG-10P规格参数

参数名称属性值
厂商名称SK Hynix(海力士)
零件包装代码MODULE
包装说明,
针数144
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式DUAL BANK PAGE BURST
JESD-30 代码R-XDMA-N168
内存密度134217728 bit
内存集成电路类型SYNCHRONOUS DRAM MODULE
内存宽度64
功能数量1
端口数量1
端子数量168
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX64
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子位置DUAL

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HYM7V64200C Z-Series
SO-DIMM 2Mx64 bit SDRAM Module
based on 2Mx8 SDRAM, LVTTL, 4K-Refresh
DESCRIPTION
The HYM7V64200C is high speed 3.3Volt CMOS Synchronous DRAM module consisting of eight 2Mx8 bit
Synchronous DRAMs in 44-pin TSOPII and one 8-pin TSSOP 2K bit EEPROM on a 168-pin glass-epoxy
circuit board. One 0.33µF and one 0.1µF decoupling capacitors are mounted for each SDRAM.
The HYM7V64200C is a gold plated socket type Dual In-line Memory Module suitable for easy interchange
and addition of 16M byte memory. All inputs and outputs are synchronized with the rising edge of the clock
input. The data paths are internally pipelined to achieve very high bandwidth. All input and output voltage
levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 1,2 or 3), the number of
consecutive read of write cycles initiated by a single control command (Burst length of 1,2,4,8, or full page),
and the burst count sequence(sequential or interleave). A burst of read of write cycles in progress can be
terminated by a burst terminate command of can be interrupted and replaced by a new burst read or write
command on any cycle. (This pipelined design is not restricted by a ‘ 2N’ rule.)
FEATURES
144Pin SO-DIMM, JEDEC Standard
Serial Presence Detect with EEPROM
Single 3.3V±0.3V power supply
All module pins are LVTTL compatible
4096 refresh cycles / 64ms
All inputs and outputs referenced to positive
edge of system clock
Auto refresh and Self Refresh
Programmable burst lengths and sequences
- 1,2,4,8 and full page for Sequential type
- 1,2,4 and 8 for Interleave type
Programmable /CAS latency ; 1,2,3 clocks
ORDERING INFORMATION
Part No.
HYM7V64200CLTZG -8
HYM7V64200CLTZG -10P
HYM7V64200CLTZG -10S
HYM7V64200CLTZG -10
Max.
Frequency
125MHz
100MHz
100MHz
100MHz
Power
L-Part
L-Part
L-Part
L-Part
PCB
height
1.00
1.00
1.00
1.00
Package
TSOPII
TSOPII
TSOPII
TSOPII
Based Comp. Part No
HY57V161610CLTC-8
HY57V161610CLTC-10P
HY57V161610CLTC-10S
HY57V161610CLTC-10
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume
any responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.5 / MAY. 98
1998 Hyundai Semiconductor

HYM7V64200CLTZG-10P相似产品对比

HYM7V64200CLTZG-10P HYM7V64200CLTZG-10S HYM7V64200CLTZG-10 HYM7V64200CLTZG-8
描述 Synchronous DRAM Module, 2MX64, CMOS, GLASS EPOXY, SODIMM-144 Synchronous DRAM Module, 2MX64, CMOS, GLASS EPOXY, SODIMM-144 Synchronous DRAM Module, 2MX64, CMOS, GLASS EPOXY, SODIMM-144 Synchronous DRAM Module, 2MX64, CMOS, GLASS EPOXY, SODIMM-144
厂商名称 SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士)
零件包装代码 MODULE MODULE MODULE MODULE
针数 144 144 144 144
Reach Compliance Code unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99
访问模式 DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
JESD-30 代码 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
内存密度 134217728 bit 134217728 bit 134217728 bit 134217728 bi
内存集成电路类型 SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
内存宽度 64 64 64 64
功能数量 1 1 1 1
端口数量 1 1 1 1
端子数量 168 168 168 168
字数 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C
组织 2MX64 2MX64 2MX64 2MX64
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 NO NO NO NO
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 DUAL DUAL DUAL DUAL

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