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SIP-1989HT-02-1001JF

产品描述TaNFilm㈢ High Temperature DIP and SIP Networks
文件大小492KB,共3页
制造商IRC ( TT Electronics )
官网地址http://www.irctt.com/
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SIP-1989HT-02-1001JF概述

TaNFilm㈢ High Temperature DIP and SIP Networks

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TaNFilm
®
High Temperature
DIP and SIP Networks
1900HT / 4700HT SERIES
·
·
·
·
·
Inherent reliability
Custom configurations available
Bonded leads not susceptible to solder reflow problems
Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C
IRC Advanced Film Division
Ceramic sandwich construction with
high temperature epoxy encapsulent
Sputtered tantalum
nitride with passivation
oxide layer
Thermo-compression
bonded leads provide
exceptional reliability
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low
profile, TaNFilm
®
DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics
of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
Electrical Data
Package
Type
Size
Schematic
Ohmic
Range
Package
Power
Element
Power
Rated Voltage
(not to exceed
rated power)
Temperature
Range
14
DIP
16
Isolated
Schematic A
Bussed
Schematic B
Isolated
Schematic A
Bussed
Schematic B
Isolated
Schematic G
Bussed
Schematic C
Isolated
Schematic G
Bussed
Schematic C
100Ω to 100KΩ
1.12W
1.00KΩ to 50KΩ
0.08W
100Ω to 100KΩ
1.28W
1.00KΩ to 50KΩ
-55°C to +200°C
50Ω to 50KΩ
0.24W
2.00KΩ to 25KΩ
0.08W
50Ω to 50KΩ
0.32W
2.00KΩ to 25KΩ
50V
100V
6
SIP
8
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
HT Series Issue November 2008 Sheet 1 of 3
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