32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, QFP144,.87SQ,20 |
| 针数 | 144 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 32 |
| CPU系列 | CORTEX-M4 |
| 最大时钟频率 | 50 MHz |
| DAC 通道 | YES |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G144 |
| 长度 | 20 mm |
| I/O 线路数量 | 100 |
| 端子数量 | 144 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 电源 | 1.8/3.3 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 65536 |
| ROM（单词） | 262144 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1.6 mm |
| 速度 | 100 MHz |
| 最大压摆率 | 85 mA |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 1.71 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 20 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| MK51DN256ZCLQ10 | MK51DN256ZCMD10R | MK51DN256ZCLQ10R | MK51DN512ZCLQ10R | MK51DN512ZCMD10R | |
|---|---|---|---|---|---|
| 描述 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFP | BGA | QFP | QFP | BGA |
| 包装说明 | LFQFP, QFP144,.87SQ,20 | LFBGA, | LFQFP, | LFQFP, | LFBGA, |
| 针数 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 具有ADC | YES | YES | YES | YES | YES |
| 位大小 | 32 | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| DAC 通道 | YES | YES | YES | YES | YES |
| DMA 通道 | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G144 | S-PBGA-B144 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B144 |
| 长度 | 20 mm | 13 mm | 20 mm | 20 mm | 13 mm |
| I/O 线路数量 | 100 | 100 | 100 | 100 | 100 |
| 端子数量 | 144 | 144 | 144 | 144 | 144 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFBGA | LFQFP | LFQFP | LFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.6 mm | 1.7 mm | 1.6 mm | 1.6 mm | 1.7 mm |
| 速度 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | BALL | GULL WING | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | QUAD | QUAD | BOTTOM |
| 宽度 | 20 mm | 13 mm | 20 mm | 20 mm | 13 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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