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IDT72V36110L7.5BBG

产品描述FIFO, 128KX36, 5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-144
产品类别存储    存储   
文件大小467KB,共48页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 全文预览

IDT72V36110L7.5BBG概述

FIFO, 128KX36, 5ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-144

IDT72V36110L7.5BBG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA,
针数144
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间5 ns
周期时间7.5 ns
JESD-30 代码S-PBGA-B144
JESD-609代码e1
长度13 mm
内存密度4718592 bit
内存宽度36
湿度敏感等级3
功能数量1
端子数量144
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.97 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度13 mm

文档预览

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3.3 VOLT HIGH-DENSITY SUPERSYNC II™
36-BIT FIFO
65,536 x 36
131,072 x 36
IDT72V36100
IDT72V36110
FEATURES:
Choose among the following memory organizations:
IDT72V36100
65,536 x 36
IDT72V36110
131,072 x 36
Higher density, 2Meg and 4Meg SuperSync II FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (PBGA Only)
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Big-Endian/Little-Endian user selectable byte representation
5V input tolerant
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (PBGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 128-pin Thin Quad Flat Pack (TQFP) or a 144-pin Plastic
Ball Grid Array (PBGA) (with additional features)
Pin compatible to the SuperSync II (IDT72V3640/72V3650/72V3660/
72V3670/72V3680/72V3690) family
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
*Available on the PBGA package only.
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
LD SEN
*
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
65,536 x 36
131,072 x 36
WRITE POINTER
FLAG
LOGIC
READ POINTER
BE
IP
BM
IW
OW
MRS
PRS
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
*
*
**
*
TCK
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
OE
Q
0
-Q
n
(x36, x18 or x9)
REN
*
6117 drw01
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2005 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2005
DSC-6117/12
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