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IDT72265LA20PF

产品描述FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
产品类别存储    存储   
文件大小354KB,共27页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72265LA20PF概述

FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64

IDT72265LA20PF规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明PLASTIC, TQFP-64
针数64
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间12 ns
其他特性RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
最大时钟频率 (fCLK)50 MHz
周期时间20 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度14 mm
内存密度294912 bit
内存集成电路类型OTHER FIFO
内存宽度18
湿度敏感等级3
功能数量1
端子数量64
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16KX18
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP64,.66SQ,32
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.017 A
最大压摆率0.08 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.8 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm

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CMOS SUPERSYNC FIFO™
8,192 x 18
16,384 x 18
Integrated Device Technology, Inc.
IDT72255LA
IDT72265LA
FEATURES:
• Choose among the following memory organizations:
IDT72255LA
8,192 x 18
IDT72265LA
16,384 x 18
• Pin-compatible with the IDT72275/72285 SuperSync FIFOs
• 10ns read/write cycle time (8ns access time)
• Fixed, low first word data latency time
• Auto power down minimizes standby power consumption
• Master Reset clears entire FIFO
• Partial Reset clears data, but retains programmable
settings
• Retransmit operation with fixed, low first word data
latency time
• Empty, Full and Half-Full flags signal FIFO status
• Programmable Almost-Empty and Almost-Full flags, each
flag can default to one of two preselected offsets
• Program partial flags by either serial or parallel means
• Select IDT Standard timing (using
EF
and
FF
flags) or First
Word Fall Through timing (using
OR
and
IR
flags)
• Output enable puts data outputs into high impedance state
• Easily expandable in depth and width
• Independent Read and Write clocks (permit reading and
writing simultaneously)
• Available in the 64-pin Thin Quad Flat Pack (TQFP) and the
64-pin Slim Thin Quad Flat Pack (STQFP)
• High-performance submicron CMOS technology
• Industrial temperature range (–40°C to +85°C) is available
DESCRIPTION:
The IDT72255LA/72265LA are exceptionally deep, high
speed, CMOS First-In-First-Out (FIFO) memories with clocked
read and write controls. These FIFOs offer numerous improve-
ments over previous SuperSync FIFOs, including the following:
• The limitation of the frequency of one clock input with
respect to the other has been removed. The Frequency
Select pin (FS) has been removed, thus it is no longer
necessary to select which of the two clock inputs, RCLK or
WCLK, is running at the higher frequency.
• The period required by the retransmit operation is now fixed
and short.
FUNCTIONAL BLOCK DIAGRAM
WCLK
D
0
-D
17
INPUT REGISTER
OFFSET REGISTER
/
WRITE CONTROL
LOGIC
RAM ARRAY
8,192 x 18
16,384 x 18
FLAG
LOGIC
/
FWFT/SI
WRITE POINTER
READ POINTER
READ
CONTROL
LOGIC
OUTPUT REGISTER
RESET
LOGIC
RCLK
Q
0
-Q
17
SuperSyncFIFO is a trademark and the IDT logo is a registered trademark of Integrated Device Technology, Inc.
4670 drw 01
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGE
©2001 Integrated Device Technology, Inc
APRIL 2001
DSC-4670/1
1

IDT72265LA20PF相似产品对比

IDT72265LA20PF IDT72265LA20PFI IDT72265LA20TFI IDT72265LA15TF IDT72265LA15TFI IDT72265LA10TF IDT72265LA10PF IDT72265LA15PF IDT72265LA15PFI IDT72265LA20TF
描述 FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 16KX18, 10ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 16KX18, 10ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 16KX18, 8ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64 FIFO, 16KX18, 8ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 16KX18, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 16KX18, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 16KX18, 12ns, Synchronous, CMOS, PQFP64, SLIM, TQFP-64
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 PLASTIC, TQFP-64 PLASTIC, TQFP-64 SLIM, TQFP-64 SLIM, TQFP-64 SLIM, TQFP-64 SLIM, TQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64 SLIM, TQFP-64
针数 64 64 64 64 64 64 64 64 64 64
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 12 ns 12 ns 12 ns 10 ns 10 ns 8 ns 8 ns 10 ns 10 ns 12 ns
最大时钟频率 (fCLK) 50 MHz 50 MHz 50 MHz 66.7 MHz 66.7 MHz 100 MHz 100 MHz 66.7 MHz 66.7 MHz 50 MHz
周期时间 20 ns 20 ns 20 ns 15 ns 15 ns 10 ns 10 ns 15 ns 15 ns 20 ns
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 14 mm 14 mm 10 mm 10 mm 10 mm 10 mm 14 mm 14 mm 14 mm 10 mm
内存密度 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 18 18 18 18 18 18 18 18 18 18
湿度敏感等级 3 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 64 64 64 64 64 64 64 64 64 64
字数 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
字数代码 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C
组织 16KX18 16KX18 16KX18 16KX18 16KX18 16KX18 16KX18 16KX18 16KX18 16KX18
可输出 YES YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LFQFP LFQFP LFQFP LFQFP LQFP LQFP LQFP LFQFP
封装等效代码 QFP64,.66SQ,32 QFP64,.66SQ,32 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.66SQ,32 QFP64,.66SQ,32 QFP64,.6SQ,32 QFP64,.47SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 240 240 240 240 240 240 240 240
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.017 A 0.017 A 0.017 A 0.017 A 0.02 A 0.017 A 0.017 A 0.017 A 0.02 A 0.017 A
最大压摆率 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 20 20 20 20 20 20 20
宽度 14 mm 14 mm 10 mm 10 mm 10 mm 10 mm 14 mm 14 mm 14 mm 10 mm
其他特性 RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH - RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH - RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
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