ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28
| 参数名称 | 属性值 |
| 厂商名称 | Maxwell_Technologies_Inc. |
| 零件包装代码 | DFP |
| 包装说明 | RAD PAK, LDFP-28 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 4.1 V |
| 最小模拟输入电压 | |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-XDFP-F28 |
| 长度 | 18.288 mm |
| 最大线性误差 (EL) | 0.8203% |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 采样速率 | 10 MHz |
| 座面最大高度 | 5.6896 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 10.414 mm |
| Base Number Matches | 1 |
| 7684RPFI | 7684RPFE | 7684RPFB | 7684RPFS | |
|---|---|---|---|---|
| 描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 |
| 零件包装代码 | DFP | DFP | DFP | DFP |
| 包装说明 | RAD PAK, LDFP-28 | RAD PAK, LDFP-28 | RAD PAK, LDFP-28 | RAD PAK, LDFP-28 |
| 针数 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大模拟输入电压 | 4.1 V | 4.1 V | 4.1 V | 4.1 V |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 |
| 长度 | 18.288 mm | 18.288 mm | 18.288 mm | 18.288 mm |
| 最大线性误差 (EL) | 0.8203% | 0.8203% | 0.8203% | 0.8203% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DFP | DFP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| 座面最大高度 | 5.6896 mm | 5.6896 mm | 5.6896 mm | 5.6896 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.414 mm | 10.414 mm | 10.414 mm | 10.414 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 厂商名称 | Maxwell_Technologies_Inc. | Maxwell_Technologies_Inc. | Maxwell_Technologies_Inc. | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
