ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28
参数名称 | 属性值 |
厂商名称 | Maxwell_Technologies_Inc. |
零件包装代码 | DFP |
包装说明 | RAD PAK, LDFP-28 |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
最大模拟输入电压 | 4.1 V |
最小模拟输入电压 | |
转换器类型 | ADC, FLASH METHOD |
JESD-30 代码 | R-XDFP-F28 |
长度 | 18.288 mm |
最大线性误差 (EL) | 0.8203% |
模拟输入通道数量 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出位码 | BINARY |
输出格式 | PARALLEL, 8 BITS |
封装主体材料 | UNSPECIFIED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
采样速率 | 10 MHz |
座面最大高度 | 5.6896 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.414 mm |
Base Number Matches | 1 |
7684RPFB | 7684RPFE | 7684RPFS | 7684RPFI | |
---|---|---|---|---|
描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, RAD PAK, LDFP-28 |
零件包装代码 | DFP | DFP | DFP | DFP |
包装说明 | RAD PAK, LDFP-28 | RAD PAK, LDFP-28 | RAD PAK, LDFP-28 | RAD PAK, LDFP-28 |
针数 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
最大模拟输入电压 | 4.1 V | 4.1 V | 4.1 V | 4.1 V |
转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 代码 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 | R-XDFP-F28 |
长度 | 18.288 mm | 18.288 mm | 18.288 mm | 18.288 mm |
最大线性误差 (EL) | 0.8203% | 0.8203% | 0.8203% | 0.8203% |
模拟输入通道数量 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DFP | DFP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
座面最大高度 | 5.6896 mm | 5.6896 mm | 5.6896 mm | 5.6896 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.414 mm | 10.414 mm | 10.414 mm | 10.414 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
厂商名称 | Maxwell_Technologies_Inc. | Maxwell_Technologies_Inc. | - | Maxwell_Technologies_Inc. |
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