512X9 OTHER FIFO, PDSO28, SOIC-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP28,.4 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 26.5 ns |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 17.9 mm |
| 内存密度 | 4608 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X9 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大待机电流 | 0.00008 A |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| 74ACT2725SC | 74ACT2725DC | 54ACT2725DM | 74ACT2725FC | 54ACT2725FM | 74ACT2725PC | 74ACT2725SCX | |
|---|---|---|---|---|---|---|---|
| 描述 | 512X9 OTHER FIFO, PDSO28, SOIC-28 | 512X9 OTHER FIFO, CDIP28, CERAMIC, DIP-28 | 512X9 OTHER FIFO, CDIP28, CERAMIC, DIP-28 | 512X9 OTHER FIFO, CDFP28, FP-28 | 512X9 OTHER FIFO, CDFP28, FP-28 | 512X9 OTHER FIFO, PDIP28, PLASTIC, DIP-28 | 512X9 OTHER FIFO, PDSO28, SOIC-28 |
| 零件包装代码 | SOIC | DIP | DIP | DFP | DFP | DIP | SOIC |
| 包装说明 | SOP, SOP28,.4 | DIP, DIP28,.6 | DIP, | DFP, FL28,.4 | DFP, FL28,.4 | DIP, DIP28,.6 | SOP, SOP28,.4 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PDSO-G28 | R-GDIP-T28 | R-GDIP-T28 | R-GDFP-F28 | R-GDFP-F28 | R-PDIP-T28 | R-PDSO-G28 |
| 内存密度 | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C |
| 组织 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | DFP | DFP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 5.715 mm | 5.715 mm | 2.286 mm | 2.286 mm | 5.334 mm | 2.65 mm |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 15.24 mm | 15.24 mm | 8.382 mm | 8.382 mm | 15.24 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 最长访问时间 | 26.5 ns | 26.5 ns | - | - | - | 26.5 ns | 26.5 ns |
| JESD-609代码 | e0 | e0 | - | e0 | - | e0 | e0 |
| 长度 | 17.9 mm | - | - | 17.8435 mm | 17.8435 mm | 35.725 mm | 17.9 mm |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | - | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 封装等效代码 | SOP28,.4 | DIP28,.6 | - | FL28,.4 | FL28,.4 | DIP28,.6 | SOP28,.4 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | 0.00008 A | 0.00008 A | - | - | - | 0.00008 A | 0.00008 A |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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