IC ABT SERIES, 8-BIT TRANSCEIVER, INVERTED OUTPUT, PDSO20, PLASTIC, TSSOP-20, Bus Driver/Transceiver
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
| 系列 | ABT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 6.5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 最大电源电流（ICC） | 30 mA |
| 传播延迟（tpd） | 4.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 74ABT620PWDH | 74ABT620D,602 | 74ABT620DB,112 | 74ABT620DB,118 | 74ABT620D,623 | 74ABT620N,602 | 74ABT620PW,112 | 74ABT620PW,118 | 74ABT620PWDH-T | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC ABT SERIES, 8-BIT TRANSCEIVER, INVERTED OUTPUT, PDSO20, PLASTIC, TSSOP-20, Bus Driver/Transceiver | IC TRANSCVR INVERT 5.5V 20SO | IC TRANSCVR INVERT 5.5V 20SSOP | IC TRANSCVR INVERT 5.5V 20SSOP | IC TRANSCVR INVERT 5.5V 20SO | IC TRANSCVR INVERT 5.5V 20DIP | IC TRANSCVR INVERT 5.5V 20TSSOP | IC TRANSCVR INVERT 5.5V 20TSSOP | IC ABT SERIES, 8-BIT TRANSCEIVER, INVERTED OUTPUT, PDSO20, Bus Driver/Transceiver |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | TSSOP, | SOP, SOP20,.4 | SSOP, SSOP20,.3 | SSOP, | SOP, | DIP, DIP20,.3 | TSSOP, TSSOP20,.25 | TSSOP, | TSSOP, |
| Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | compliant | compliant | unknown | unknown |
| 其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION |
| 系列 | ABT | ABT | ABT | ABT | ABT | ABT | ABT | ABT | ABT |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| 长度 | 6.5 mm | 12.8 mm | 7.2 mm | 7.2 mm | 12.8 mm | 26.73 mm | 6.5 mm | 6.5 mm | 6.5 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | SSOP | SSOP | SOP | DIP | TSSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 最大电源电流（ICC） | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA | 30 mA |
| 传播延迟（tpd） | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 2.65 mm | 2 mm | 2 mm | 2.65 mm | 4.2 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 4.4 mm | 7.5 mm | 5.3 mm | 5.3 mm | 7.5 mm | 7.62 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 零件包装代码 | TSSOP | SOIC | SSOP | SSOP | SOIC | DIP | TSSOP | TSSOP | - |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| Brand Name | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | - | 1 | 1 | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
FPGA/CPLD
stm32/stm8
嵌入式系统
嵌入式系统
嵌入式系统
FPGA/CPLD
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