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IDT72P51759L6BB8

产品描述FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256
产品类别存储    存储   
文件大小804KB,共87页
制造商IDT (Integrated Device Technology)
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IDT72P51759L6BB8概述

FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256

IDT72P51759L6BB8规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA256,16X16,40
针数256
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间3.7 ns
最大时钟频率 (fCLK)166 MHz
周期时间6 ns
JESD-30 代码S-PBGA-B256
JESD-609代码e0
长度17 mm
内存密度2359296 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量256
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA256,16X16,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
电源1.8 V
认证状态Not Qualified
座面最大高度3.5 mm
最大待机电流0.1 A
最大压摆率0.15 mA
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
宽度17 mm
Base Number Matches1

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1.8V MULTI-QUEUE FLOW-CONTROL DEVICES
(128 QUEUES) 36 BIT WIDE CONFIGURATION
1,179,648 bits
2,359,296 bits
4,718,592 bits
ADVANCE INFORMATION
IDT72P51749
IDT72P51759
IDT72P51769
FEATURES
Choose from among the following memory density options:
IDT72P51749
Total Available Memory = 1,179,648 bits
IDT72P51759
Total Available Memory = 2,359,296 bits
IDT72P51769
Total Available Memory = 4,718,592 bits
Configurable from 1 to 128 Queues
Default configuration of 128 or 64 symmetrical queues
Default multi-queue device configurations
– IDT72P51749: 256 x 36 x 128Q
– IDT72P51759: 512 x 36 x 128Q
– IDT72P51769: 1,024 x 36 x 128Q
Default configuration can be augmented via the queue address
bus
Number of queues and individual queue sizes may be
configured at master reset though serial programming
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Independent Read and Write access per queue
User Selectable Bus Matching Options:
– x36 in to x36 out
– x18 in to x36 out
– x9 in to x36 out
– x36in to x18out
– x18 in to x18 out
– x9 in to x18 out
– x36in to x9out
– x18 in to x9 out
– x9 in to x9 out
User selectable I/O: 1.5V HSTL, 1.8V eHSTL, or 2.5V LVTTL
100% Bus Utilization, Read and Write on every clock cycle
Selectable First Word Fall Through (FWFT) or IDT standard
mode of operation
Ability to operate on packet or word boundaries
Mark and Re-Write operation
Mark and Re-Read operation
Individual, Active queue flags (OR /
EF, IR
/
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Direct or polled operation of flag status bus
Expansion of up to 256 queues
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
WADEN
FSTR
WRADD
WEN
WCLK
WCS
8
READ CONTROL
Q127
RADEN
ESTR
RDADD
8
WRITE CONTROL
Q126
REN
RCLK
RCS
OE
Q125
Din
Qout
x36, 18 or x9
DATA IN
x36, x18 or x9
DATA OUT
READ FLAGS
EF/OR
PR
PAE
PAEn
8
WRITE FLAGS
FF/IR
PAF
PAFn
8
Q0
PRn
6714 drw01
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2004
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
SEPTEMBER 2004
DSC-6714/-

IDT72P51759L6BB8相似产品对比

IDT72P51759L6BB8 IDT72P51749L6BB8 IDT72P51749L5BB8 IDT72P51769L5BB8 IDT72P51769L6BB8 IDT72P51759L5BB8
描述 FIFO, 64KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 32KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 32KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 FIFO, 128KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 128KX36, 3.7ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 FIFO, 64KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 BGA, BGA256,16X16,40
针数 256 256 256 256 256 256
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 3.7 ns 3.7 ns 3.6 ns 3.6 ns 3.7 ns 3.6 ns
最大时钟频率 (fCLK) 166 MHz 166 MHz 200 MHz 200 MHz 166 MHz 200 MHz
周期时间 6 ns 6 ns 5 ns 5 ns 6 ns 5 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm
内存密度 2359296 bit 1179648 bit 1179648 bit 4718592 bit 4718592 bit 2359296 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 256 256 256 256 256 256
字数 65536 words 32768 words 32768 words 131072 words 131072 words 65536 words
字数代码 64000 32000 32000 128000 128000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 64KX36 32KX36 32KX36 128KX36 128KX36 64KX36
可输出 YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm 3.5 mm
最大待机电流 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A 0.1 A
最大压摆率 0.15 mA 0.15 mA 0.15 mA 0.15 mA 0.15 mA 0.15 mA
最大供电电压 (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 17 mm 17 mm 17 mm 17 mm 17 mm 17 mm

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