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71V65803S150BQGI

产品描述ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA165, 13 X 15 MM, BGA-165
产品类别存储    存储   
文件大小950KB,共26页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

71V65803S150BQGI概述

ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA165, 13 X 15 MM, BGA-165

71V65803S150BQGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明TBGA, BGA165,11X15,40
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间3.8 ns
其他特性PIPELINED ARCHITECTURE
I/O 类型COMMON
JESD-30 代码R-PBGA-B165
JESD-609代码e1
长度15 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.06 A
最小待机电流3.14 V
最大压摆率0.345 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度13 mm
Base Number Matches1

文档预览

下载PDF文档
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
IDT71V65603
IDT71V65803
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
BW
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array(fBGA).
Description
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803 to
be suspended as long as necessary. All synchronous inputs are ignored when
(CEN) is high and the internal device registers will hold their previous values.
There are three chip enable pins (CE1, CE2,
CE2)
that allow the user
to deselect the device when desired. If any one of these three are not asserted
when ADV/LD is low, no new memory operation can be initiated. However,
any pending data transfers (reads or writes) will be completed. The data bus
will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and
165 fine pitch ball grid array (fBGA) .
Pin Description Summary
A
0
-A
18
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5304 tbl 01
CE
1
, CE
2
,
CE
2
OE
R/
W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/
LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
SEPTEMBER 2004
DSC-5304/06
1
©2004 Integrated Device Technology, Inc.

71V65803S150BQGI相似产品对比

71V65803S150BQGI 71V65803S150PFI 71V65803S150BGGI IDT71V65803S150BGGI IDT71V65803S150BQGI
描述 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA165, 13 X 15 MM, BGA-165 ZBT SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136, TQFP-100 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MO-028AA, BGA-119 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MO-028AA, BGA-119 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA165, 13 X 15 MM, BGA-165
是否Rohs认证 符合 不符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA QFP BGA BGA BGA
包装说明 TBGA, BGA165,11X15,40 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136, TQFP-100 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 TBGA, BGA165,11X15,40
针数 165 100 119 119 165
Reach Compliance Code compliant not_compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3.8 ns 3.8 ns 3.8 ns 3.8 ns 3.8 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
I/O 类型 COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PBGA-B165 R-PQFP-G100 R-PBGA-B119 R-PBGA-B119 R-PBGA-B165
JESD-609代码 e1 e0 e1 e1 e1
长度 15 mm 20 mm 22 mm 22 mm 15 mm
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 18 18 18 18 18
湿度敏感等级 3 3 3 3 3
功能数量 1 1 1 1 1
端子数量 165 100 119 119 165
字数 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
组织 512KX18 512KX18 512KX18 512KX18 512KX18
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TBGA LQFP BGA BGA TBGA
封装等效代码 BGA165,11X15,40 QFP100,.63X.87 BGA119,7X17,50 BGA119,7X17,50 BGA165,11X15,40
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE FLATPACK, LOW PROFILE GRID ARRAY GRID ARRAY GRID ARRAY, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 240 260 260 260
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.6 mm 2.36 mm 2.36 mm 1.2 mm
最大待机电流 0.06 A 0.06 A 0.06 A 0.06 A 0.06 A
最小待机电流 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
最大压摆率 0.345 mA 0.345 mA 0.345 mA 0.345 mA 0.345 mA
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn85Pb15) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL GULL WING BALL BALL BALL
端子节距 1 mm 0.65 mm 1.27 mm 1.27 mm 1 mm
端子位置 BOTTOM QUAD BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 20 30 30 30
宽度 13 mm 14 mm 14 mm 14 mm 13 mm
Base Number Matches 1 1 1 1 1
是否无铅 不含铅 - 不含铅 不含铅 不含铅
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