电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT71V65803S150BGGI

产品描述ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MO-028AA, BGA-119
产品类别存储   
文件大小950KB,共26页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT71V65803S150BGGI概述

ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MO-028AA, BGA-119

IDT71V65803S150BGGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA119,7X17,50
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间3.8 ns
其他特性PIPELINED ARCHITECTURE
I/O 类型COMMON
JESD-30 代码R-PBGA-B119
JESD-609代码e1
长度22 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量119
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA119,7X17,50
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度2.36 mm
最大待机电流0.06 A
最小待机电流3.14 V
最大压摆率0.345 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
ZBT™ Feature
3.3V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
IDT71V65603
IDT71V65803
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
BW
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array(fBGA).
Description
The IDT71V65603/5803 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or writes and
reads. Thus, they have been given the name ZBT
TM
, or Zero Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65603/5803 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used
to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65603/5803 to
be suspended as long as necessary. All synchronous inputs are ignored when
(CEN) is high and the internal device registers will hold their previous values.
There are three chip enable pins (CE1, CE2,
CE2)
that allow the user
to deselect the device when desired. If any one of these three are not asserted
when ADV/LD is low, no new memory operation can be initiated. However,
any pending data transfers (reads or writes) will be completed. The data bus
will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65603/5803 have an on-chip burst counter. In the burst
mode, the IDT71V65603/5803 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65603/5803 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and
165 fine pitch ball grid array (fBGA) .
Pin Description Summary
A
0
-A
18
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5304 tbl 01
CE
1
, CE
2
,
CE
2
OE
R/
W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/
LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
SEPTEMBER 2004
DSC-5304/06
1
©2004 Integrated Device Technology, Inc.

IDT71V65803S150BGGI相似产品对比

IDT71V65803S150BGGI 71V65803S150PFI 71V65803S150BGGI 71V65803S150BQGI IDT71V65803S150BQGI
描述 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MO-028AA, BGA-119 ZBT SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136, TQFP-100 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MO-028AA, BGA-119 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA165, 13 X 15 MM, BGA-165 ZBT SRAM, 512KX18, 3.8ns, CMOS, PBGA165, 13 X 15 MM, BGA-165
是否Rohs认证 符合 不符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA QFP BGA BGA BGA
包装说明 BGA, BGA119,7X17,50 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136, TQFP-100 BGA, BGA119,7X17,50 TBGA, BGA165,11X15,40 TBGA, BGA165,11X15,40
针数 119 100 119 165 165
Reach Compliance Code compliant not_compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3.8 ns 3.8 ns 3.8 ns 3.8 ns 3.8 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
I/O 类型 COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PBGA-B165 R-PBGA-B165
JESD-609代码 e1 e0 e1 e1 e1
长度 22 mm 20 mm 22 mm 15 mm 15 mm
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 18 18 18 18 18
湿度敏感等级 3 3 3 3 3
功能数量 1 1 1 1 1
端子数量 119 100 119 165 165
字数 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
组织 512KX18 512KX18 512KX18 512KX18 512KX18
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA LQFP BGA TBGA TBGA
封装等效代码 BGA119,7X17,50 QFP100,.63X.87 BGA119,7X17,50 BGA165,11X15,40 BGA165,11X15,40
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 240 260 260 260
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.36 mm 1.6 mm 2.36 mm 1.2 mm 1.2 mm
最大待机电流 0.06 A 0.06 A 0.06 A 0.06 A 0.06 A
最小待机电流 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
最大压摆率 0.345 mA 0.345 mA 0.345 mA 0.345 mA 0.345 mA
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn85Pb15) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL GULL WING BALL BALL BALL
端子节距 1.27 mm 0.65 mm 1.27 mm 1 mm 1 mm
端子位置 BOTTOM QUAD BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 20 30 30 30
宽度 14 mm 14 mm 14 mm 13 mm 13 mm
Base Number Matches 1 1 1 1 1
是否无铅 不含铅 - 不含铅 不含铅 不含铅
【问题探讨】对比试验后,谈谈stm32单片机中断程序中加延时可能引发程序死机问题
我很少在中断函数里面调用延时程序,主要是最初接触单片机的时候前辈们就这样教的。说程序容易跑飞,之前也一直没出现过这样的情况。最近做一个东西,无意中在中断中加了一个us级的延时,用for( ......
jonny0811 stm32/stm8
IC封装相关的一些基础材料
IC封装相关的一些基础材料...
ruopu PCB设计
想通过定义共用体将结构体发送出去,如何解决对齐问题?
typedef struct //定义帧结构体 { uint8_t FrameHead_1; uint8_t FrameHead_2; uint8_t FrameID; uint8_t FrameCount; int16_t AngleInt1; int16_t AngleInt2; ui ......
milan111 NXP MCU
大家好,我是新手,想买一个arm开发板,我是买arm9好呢还是arm11好,谢谢大家
各位大侠 ,帮帮我,我是电子类专业的学生,很纠结啊,还有啊 我怎么上手 快点呢?????...
qinsong ARM技术
EMI 的工程师指南 — 规范和测量
EMI 测试的规范与测量 简介 多数电源应用必须减少电磁干扰 (EMI) 以满足相关要求,系统设计人员必须尝试各种方法来减少传导和辐射发射。 电磁兼容性 (EMC) 标准的合规性(例如, ......
qwqwqw2088 模拟与混合信号
求助:555定时不准确,跟温度有关么?
555作为单稳态触发器,定时为2.5ms最初正常,持续一段时间后,脉冲宽度变小。停机重启,定时时间变长。在工作过程中,温度在不断升高,升高到40度左右,不知道是不是这个原因造成的误差。...
Grizabella 模拟电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2242  2254  2109  2017  2450  10  59  50  32  49 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved