PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PQCC40, LEAD FREE ANNEALED, PLASTIC, MLF-40
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | DFN |
包装说明 | HVQCCN, LCC40,.24SQ,20 |
针数 | 40 |
制造商包装代码 | MLF |
Reach Compliance Code | compliant |
系列 | 97ULP |
输入调节 | DIFFERENTIAL |
JESD-30 代码 | S-PQCC-N40 |
JESD-609代码 | e3 |
长度 | 6 mm |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
湿度敏感等级 | 3 |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 40 |
实输出次数 | 10 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC40,.24SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8 V |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.04 ns |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 6 mm |
最小 fmax | 410 MHz |
Base Number Matches | 1 |
ICS97ULP877BKLF-T | ICS97ULP877BH-T | 97ULP877BKLF-T | ICS97ULP877BK-T | |
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描述 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PQCC40, LEAD FREE ANNEALED, PLASTIC, MLF-40 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PBGA52, MO-205, MO-225, BGA-52 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PQCC40, LEAD FREE ANNEALED, PLASTIC, MLF-40 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PQCC40, PLASTIC, MLF-40 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | DFN | BGA | DFN | DFN |
包装说明 | HVQCCN, LCC40,.24SQ,20 | VFBGA, BGA52,6X10,25 | HVQCCN, LCC40,.24SQ,20 | HVQCCN, LCC40,.24SQ,20 |
针数 | 40 | 52 | 40 | 40 |
Reach Compliance Code | compliant | not_compliant | compliant | not_compliant |
系列 | 97ULP | 97ULP | 97ULP | 97ULP |
输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
JESD-30 代码 | S-PQCC-N40 | R-PBGA-B52 | S-PQCC-N40 | S-PQCC-N40 |
JESD-609代码 | e3 | e0 | e3 | e0 |
长度 | 6 mm | 7 mm | 6 mm | 6 mm |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
湿度敏感等级 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 40 | 52 | 40 | 40 |
实输出次数 | 10 | 10 | 10 | 10 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | VFBGA | HVQCCN | HVQCCN |
封装等效代码 | LCC40,.24SQ,20 | BGA52,6X10,25 | LCC40,.24SQ,20 | LCC40,.24SQ,20 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 225 | NOT SPECIFIED | 225 |
电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.04 ns | 0.04 ns | 0.04 ns | 0.04 ns |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed | Tin/Lead (Sn63Pb37) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD | BALL | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | BOTTOM | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 |
宽度 | 6 mm | 5.5 mm | 6 mm | 6 mm |
最小 fmax | 410 MHz | 410 MHz | 410 MHz | 410 MHz |
是否无铅 | 不含铅 | 含铅 | - | 含铅 |
制造商包装代码 | MLF | - | MLF | MLF |
Base Number Matches | 1 | 1 | 1 | - |
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