PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PBGA52, MO-205, MO-225, BGA-52
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA52,6X10,25 |
| 针数 | 52 |
| Reach Compliance Code | not_compliant |
| 系列 | 97ULP |
| 输入调节 | DIFFERENTIAL |
| JESD-30 代码 | R-PBGA-B52 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 反相输出次数 | |
| 端子数量 | 52 |
| 实输出次数 | 10 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA52,6X10,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.8 V |
| 认证状态 | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.04 ns |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5.5 mm |
| 最小 fmax | 410 MHz |
| Base Number Matches | 1 |
| 97ULP877BH-T | 97ULP877BHLF-T | ICS97ULP877BHLF-T | ICS97ULP877BK | |
|---|---|---|---|---|
| 描述 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PBGA52, MO-205, MO-225, BGA-52 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PBGA52, LEAD FREE ANNEALED, MO-205, MO-225, BGA-52 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PBGA52, LEAD FREE ANNEALED, MO-205, MO-225, BGA-52 | PLL Based Clock Driver, 97ULP Series, 10 True Output(s), 0 Inverted Output(s), PQCC40, PLASTIC, MLF-40 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA | BGA | BGA | DFN |
| 包装说明 | VFBGA, BGA52,6X10,25 | VFBGA, BGA52,6X10,25 | VFBGA, BGA52,6X10,25 | HVQCCN, |
| 针数 | 52 | 52 | 52 | 40 |
| Reach Compliance Code | not_compliant | compliant | compliant | unknown |
| 系列 | 97ULP | 97ULP | 97ULP | 97ULP |
| 输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
| JESD-30 代码 | R-PBGA-B52 | R-PBGA-B52 | R-PBGA-B52 | S-PQCC-N40 |
| 长度 | 7 mm | 7 mm | 7 mm | 6 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 52 | 52 | 52 | 40 |
| 实输出次数 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | VFBGA | VFBGA | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.04 ns | 0.04 ns | 0.04 ns | 0.04 ns |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | QUAD |
| 宽度 | 5.5 mm | 5.5 mm | 5.5 mm | 6 mm |
| 最小 fmax | 410 MHz | 410 MHz | 410 MHz | 350 MHz |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | - |
| JESD-609代码 | e0 | e1 | e1 | - |
| 湿度敏感等级 | 3 | 3 | 3 | - |
| 封装等效代码 | BGA52,6X10,25 | BGA52,6X10,25 | BGA52,6X10,25 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | - |
| 电源 | 1.8 V | 1.8 V | 1.8 V | - |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | 30 | - |
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