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IDT71V3566S133PF

产品描述ZBT SRAM, 128KX36, 4.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100
产品类别存储    存储   
文件大小306KB,共23页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT71V3566S133PF概述

ZBT SRAM, 128KX36, 4.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100

IDT71V3566S133PF规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明14 X 20 MM, PLASTIC, TQFP-100
针数100
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间4.5 ns
JESD-30 代码R-PQFP-G100
JESD-609代码e0
长度20 mm
内存密度4718592 bit
内存集成电路类型ZBT SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量100
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX36
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

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128K x 36, 256K x 18
Smart ZBT™ 3.3V Synchronous SRAMs
3.3V I/O, Burst Counter
Pipelined Outputs
Features
128K x 36, 256K x 18 memory configurations
Supports high performance system speed - from 66MHz to
133MHz
ZBT
TM
Feature - No dead cycles between write and read
cycles
Smart ZBT
TM
Feature - Eases system timing requirements
and reduces the likelihood of bus contention
With Smart ZBT
TM
the output turn-on (t
CLZ
) is adaptable to
the user's system and is a function of the cycle time
Backward compatible with IDT's existing ZBT offerings
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
BW
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%)
3.3V I/O Supply (V
DDQ)
Packaged in a JEDEC standard 100-lead plastic thin quad
flatpack (TQFP) and 119-lead ball grid array (BGA).
Preliminary
IDT71V3566
IDT71V3568
x
x
Description
The IDT71V3566/68 are 3.3V high-speed 4,718,592-bit (4.5 Mega-
bit) synchronous SRAMs. They are designed to eliminate dead bus
cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or
Zero Bus Turnaround.
Address and control signals are applied to the SRAM during one
clock cycle, and two cycles later the associated data cycle occurs, be it
read or write.
The IDT71V3566/68 offer the user a Smart functionality which simplifies
system timing requirements when turning the bus around between writes
and reads. Traditionally, SRAMs are designed with fast turn-on times
(t
CLZ
) in order to meet the requirements of high speed applications. This
fast turn-on may lead to bus contention at slower speeds, i.e. 133 MHz and
slower, since these designs often use less aggressive ASICs/controllers
with loose turn-off parameters (t
CHZ
). Thus at slower speeds, more margin
on the RAM's t
CLZ
may be needed to compensate for the slow turn-off of
the ASIC/controller. The IDT71V3566/68 have the ability to provide this
extra margin by allowing t
CLZ
to adapt to the user's system.
With the Smart ZBT
TM
feature, the output turn-on time (t
CLZ
) adapts to
the user's system and is solely a function of cycle time (t
CYC
). Thus with
Smart ZBT
TM
, t
CLZ
is independent of process, voltage, and temperature
variations. With this deterministic output turn-on feature, the guesswork of
when the SRAM begins to drive the bus is removed, therefore easing
x
x
x
x
x
x
x
x
x
x
x
x
x
Pin Description Summary
A
0
-A
1 7
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
A DV /LD
LBO
I/O
0
-I/O
3 1
, I/O
P 1
-I/O
P 4
V
DD
, V
DDQ
V
SS
A d d re s s Inp uts
Chip E nab le s
Outp ut E nab le
Re ad /W rite S ig nal
Clo c k E nab le
Ind ivid ual B y te W rite S e le cts
Clo ck
A d v anc e b urst ad d re ss / Lo ad ne w ad d re ss
Line ar / Inte rle av e d B urs t Ord e r
Data Inp ut / Outp ut
Co re P o we r, I/O P o we r
Gro und
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
Inp ut
I/O
S up p ly
S up p ly
S ynchro no us
S ynchro no us
A s ync hro no us
S ynchro no us
S ynchro no us
S ynchro no us
N/A
S ynchro no us
S tatic
S ynchro no us
S tatic
S tatic
5295 tbl 01
ZBT and ZeroBus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola Inc.
Smart ZBT and Smart Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is also supported by Micron Technology, Inc.
DECEMBER 1999
DSC-5295/00
1
©1999 Integrated Device Technology, Inc.

IDT71V3566S133PF相似产品对比

IDT71V3566S133PF IDT71V3568S100BG IDT71V3568S100PF IDT71V3568S133BG IDT71V3568S133PF IDT71V3566S133BG
描述 ZBT SRAM, 128KX36, 4.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 ZBT SRAM, 256KX18, 5.33ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX18, 5.33ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 ZBT SRAM, 256KX18, 4.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX18, 4.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 ZBT SRAM, 128KX36, 4.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFP BGA QFP BGA QFP BGA
包装说明 14 X 20 MM, PLASTIC, TQFP-100 14 X 22 MM, PLASTIC, BGA-119 14 X 20 MM, PLASTIC, TQFP-100 14 X 22 MM, PLASTIC, BGA-119 14 X 20 MM, PLASTIC, TQFP-100 14 X 22 MM, PLASTIC, BGA-119
针数 100 119 100 119 100 119
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 4.5 ns 5.33 ns 5.33 ns 4.5 ns 4.5 ns 4.5 ns
JESD-30 代码 R-PQFP-G100 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 20 mm 22 mm 20 mm 22 mm 20 mm 22 mm
内存密度 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 36 18 18 18 18 36
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 100 119 100 119 100 119
字数 131072 words 262144 words 262144 words 262144 words 262144 words 131072 words
字数代码 128000 256000 256000 256000 256000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 128KX36 256KX18 256KX18 256KX18 256KX18 128KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP BGA LQFP BGA LQFP BGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 225 240 225 240 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 3.5 mm 1.6 mm 3.5 mm 1.6 mm 3.5 mm
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING BALL GULL WING BALL GULL WING BALL
端子节距 0.65 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm
端子位置 QUAD BOTTOM QUAD BOTTOM QUAD BOTTOM
处于峰值回流温度下的最长时间 20 20 20 20 20 20
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Base Number Matches 1 1 1 1 - -
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