Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | 8051 |
| JESD-30 代码 | R-XDIP-T40 |
| JESD-609代码 | e0 |
| 端子数量 | 40 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 128 |
| ROM(单词) | 0 |
| 速度 | 12 MHz |
| 最大压摆率 | 20 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MD80C31 | MR80C31-1/B | MR80C31-1 | MJ80C31-1/B | MJ80C31-1 | MJ80C31 | |
|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40, | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CQCC44, | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CQCC44, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | R-XDIP-T40 | S-XQCC-N44 | S-XQCC-N44 | S-XQCC-J44 | S-XQCC-J44 | S-XQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 40 | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | QCCN | QCCN | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | DIP40,.6 | LCC44,.65SQ | LCC44,.65SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 128 | 128 | 128 | 128 | 128 | 128 |
| 速度 | 12 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 12 MHz |
| 最大压摆率 | 20 mA | 25.9 mA | 25.9 mA | 25.9 mA | 25.9 mA | 20 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | J BEND | J BEND | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved