1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | TSSOP, |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G3 |
| JESD-609代码 | e3 |
| 长度 | 2.86 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 3 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.15 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 1.295 mm |
| MIC1815-10UY | MIC1815 | MIC1815-10U | MIC1815-20U | MIC1815_05 | MIC1815-20UY | |
|---|---|---|---|---|---|---|
| 描述 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 |
| 是否Rohs认证 | 符合 | - | 不符合 | 不符合 | - | 符合 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) |
| 包装说明 | TSSOP, | - | TSSOP, TO-236 | TSSOP, TO-236 | - | TSSOP, |
| Reach Compliance Code | compli | - | compli | compli | - | compli |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 |
| 可调阈值 | NO | - | NO | NO | - | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G3 | - | R-PDSO-G3 | R-PDSO-G3 | - | R-PDSO-G3 |
| JESD-609代码 | e3 | - | e0 | e0 | - | e3 |
| 长度 | 2.86 mm | - | 2.86 mm | 2.86 mm | - | 2.86 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | - | 1 |
| 信道数量 | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | 3 | - | 3 | 3 | - | 3 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | TSSOP | TSSOP | - | TSSOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 240 | 240 | - | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.15 mm | - | 1.15 mm | 1.15 mm | - | 1.15 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | - | 1 V | 1 V | - | 1 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | - | YES | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | MATTE TIN | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | MATTE TIN |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | - | GULL WING |
| 端子位置 | DUAL | - | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | 30 | 30 | - | 40 |
| 宽度 | 1.295 mm | - | 1.295 mm | 1.295 mm | - | 1.295 mm |
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