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Datasheet> 器件分类 > 模拟混合信号IC> 信号电路> CD4051BF/3W

CD4051BF/3W: 产品描述Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16; 产品类别模拟混合信号IC 信号电路; 文件大小341KB，共7页; 制造商RCA

下载文档详细参数选型对比全文预览

CD4051BF/3W概述

Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16

CD4051BF/3W规格参数

参数名称	属性值
是否Rohs认证	不符合
包装说明	DIP, DIP16,.3
Reach Compliance Code	unknown
模拟集成电路 - 其他类型	SINGLE-ENDED MULTIPLEXER
JESD-30 代码	R-XDIP-T16
JESD-609代码	e0
信道数量	8
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC
封装代码	DIP
封装等效代码	DIP16,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	5/15 V
认证状态	Not Qualified
筛选级别	MIL-STD-883 Class B (Modified)
表面贴装	NO
切换	BREAK-BEFORE-MAKE
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
Base Number Matches	1

CD4051BF/3W相似产品对比

	CD4051BF/3W	CD4052BF/3	CD4052BF/3A	CD4052BDX	CD4053BEX	CD4051BK/3	CD4052BE98	CD4053BD/3	CD4053BD/3W	CD4053BF/3
描述	Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16	Multiplexers/Switches, 1 Func, 4 Channel, CMOS, CDIP16	Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16	Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16	Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, PDIP16,	Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDFP16	Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP16,	Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16	Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16	Multiplexers/Switches, 3 Func, 2 Channel, CMOS, CDIP16
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
JESD-30 代码	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDFP-F16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
信道数量	8	4	4	4	2	8	4	2	2	2
功能数量	1	1	1	1	3	1	1	3	3	3
端子数量	16	16	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	85 °C	125 °C	85 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
封装代码	DIP	DIP	DIP	DIP	DIP	DFP	DIP	DIP	DIP	DIP
封装等效代码	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE
电源	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
表面贴装	NO	NO	NO	NO	NO	YES	NO	NO	NO	NO
切换	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	MILITARY	MILITARY
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
模拟集成电路 - 其他类型	SINGLE-ENDED MULTIPLEXER	-	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	-
认证状态	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Base Number Matches	1	1	1	1	1	1	-	-	-	-

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