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CY7C1344F-100ACT

产品描述Cache SRAM, 64KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
产品类别存储    存储   
文件大小307KB,共15页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

CY7C1344F-100ACT概述

Cache SRAM, 64KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

CY7C1344F-100ACT规格参数

参数名称属性值
零件包装代码QFP
包装说明LQFP,
针数100
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
最长访问时间8 ns
其他特性FLOW-THROUGH ARCHITECTURE
JESD-30 代码R-PQFP-G100
JESD-609代码e4
长度20 mm
内存密度2359296 bit
内存集成电路类型CACHE SRAM
内存宽度36
功能数量1
端子数量100
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX36
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层NICKEL PALLADIUM GOLD
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
宽度14 mm
Base Number Matches1

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CY7C1344F
2-Mbit (64K x 36) Flow-Through Sync SRAM
Features
• 64K x 36 common I/O
• 3.3V –5% and +10% core power supply (V
DD
)
• 3.3V I/O supply (V
DDQ
)
• Fast clock-to-output times
— 7.5 ns (117-MHz version)
— 8.0 ns (100-MHz version)
• Provide high-performance 2-1-1-1 access rate
• User-selectable burst counter supporting Intel
Pentium
interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed write
• Asynchronous output enable
• Supports 3.3V I/O level
• Offered in JEDEC-standard 100-pin TQFP package
• “ZZ” Sleep Mode option
Functional Description
[1]
The CY7C1344F is a 65,536 x 36 synchronous cache RAM
designed to interface with high-speed microprocessors with
minimum glue logic. Maximum access delay from clock rise is
7.5 ns (117-MHz version). A 2-bit on-chip counter captures the
first address in a burst and increments the address automati-
cally for the rest of the burst access. All synchronous inputs
are gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE
1
), depth-expansion Chip Enables (CE
2
and CE
3
), Burst
Control inputs (ADSC, ADSP, and ADV), Write Enables
(BW
[A:D]
, and BWE), and Global Write (GW). Asynchronous
inputs include the Output Enable (OE) and the ZZ pin.
The CY7C1344F allows either interleaved or linear burst
sequences, selected by the MODE input pin. A HIGH selects
an interleaved burst sequence, while a LOW selects a linear
burst sequence. Burst accesses can be initiated with the
Processor Address Strobe (ADSP) or the cache Controller
Address Strobe (ADSC) inputs. Address advancement is
controlled by the Address Advancement (ADV) input.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
The CY7C1344F operates from a +3.3V core power supply
while all outputs may operate with a +3.3V supply. All inputs
and outputs are JEDEC-standard JESD8-5-compatible.
Logic Block Diagram
A0, A1, A
ADDRESS
REGISTER
A
[1:0]
MODE
ADV
CLK
BURST Q1
COUNTER
AND LOGIC
Q0
CLR
ADSC
ADSP
DQ
D
,
DQP
D
BW
D
BYTE
WRITE REGISTER
DQ
C
,
DQP
C
BYTE
WRITE REGISTER
DQ
B
,
DQP
B
BYTE
WRITE REGISTER
DQ
A
,
DQP
A
BW
A
BWE
GW
CE1
CE2
CE3
OE
DQ
A
,
DQP
A
BYTE
WRITE REGISTER
BYTE
WRITE REGISTER
DQ
D
,
DQP
D
BYTE
WRITE REGISTER
DQ
C
,
DQP
C
BYTE
WRITE REGISTER
DQ
B
,
DQP
B
BW
B
BYTE
WRITE REGISTER
BW
C
MEMORY
ARRAY
SENSE
AMPS
OUTPUT
BUFFERS
DQs
DQP
A
DQP
B
DQP
C
DQP
D
ENABLE
REGISTER
INPUT
REGISTERS
ZZ
SLEEP
CONTROL
Note:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05432 Rev. *A
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised April 9, 2004

CY7C1344F-100ACT相似产品对比

CY7C1344F-100ACT CY7C1344F-100AXC
描述 Cache SRAM, 64KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cache SRAM, 64KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, 1.4 MM HEIGHT, PLASTIC, TQFP-100
零件包装代码 QFP QFP
包装说明 LQFP, LQFP,
针数 100 100
Reach Compliance Code unknown compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A
最长访问时间 8 ns 8 ns
其他特性 FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 代码 R-PQFP-G100 R-PQFP-G100
JESD-609代码 e4 e4
长度 20 mm 20 mm
内存密度 2359296 bit 2359296 bit
内存集成电路类型 CACHE SRAM CACHE SRAM
内存宽度 36 36
功能数量 1 1
端子数量 100 100
字数 65536 words 65536 words
字数代码 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 64KX36 64KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 GULL WING GULL WING
端子节距 0.65 mm 0.65 mm
端子位置 QUAD QUAD
宽度 14 mm 14 mm
Base Number Matches 1 1

 
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