IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | COP800 |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 8192 |
| ROM可编程性 | FLASH |
| 速度 | 20 MHz |
| 最大压摆率 | 12.4 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| COP8CFE9HVA7 | COP8CFE9HLQ8 | COP8CFE9HLQ7 | COP8CFE9IMT7 | COP8CFE9IMT8 | COP8CFE9HVA8 | |
|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LDCC,44PIN,PLASTIC | IC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, QCC44, LLP-44, Microcontroller | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LLCC,44PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,TSSOP,48PIN,PLASTIC | IC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PDSO48, TSSOP-48, Microcontroller | IC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44, Microcontroller |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC44,.7SQ | VQCCN, LCC44,.28SQ,20 | QCCN, LCC44,.28SQ,20 | TSSOP, TSSOP48,.3,20 | TSSOP, TSSOP48,.3,20 | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 |
| JESD-30 代码 | S-PQCC-J44 | S-XQCC-N44 | S-PQCC-N44 | R-PDSO-G48 | R-PDSO-G48 | S-PQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 44 | 44 | 44 | 48 | 48 | 44 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | VQCCN | QCCN | TSSOP | TSSOP | QCCJ |
| 封装等效代码 | LDCC44,.7SQ | LCC44,.28SQ,20 | LCC44,.28SQ,20 | TSSOP48,.3,20 | TSSOP48,.3,20 | LDCC44,.7SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER |
| 电源 | 5 V | 3/5 V | 5 V | 5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM（单词） | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 速度 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 最大压摆率 | 12.4 mA | 11.5 mA | 12.4 mA | 12.4 mA | 11.5 mA | 11.5 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | NO LEAD | NO LEAD | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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