8-BIT, MROM, 10MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44
| 参数名称 | 属性值 |
| 包装说明 | LQFP, |
| Reach Compliance Code | unknown |
| 具有ADC | NO |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 10 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G44 |
| 长度 | 10 mm |
| I/O 线路数量 | 40 |
| 端子数量 | 44 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 1.6 mm |
| 速度 | 10 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 宽度 | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| COP8SGR5VEJ8 | COP8SGG5VEJ8 | COP8SGH5VEJ8 | COP8SGK5VEJ8 | COP8SGE5VEJ8 | |
|---|---|---|---|---|---|
| 描述 | 8-BIT, MROM, 10MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 | 8-BIT, MROM, 10MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 | 8-BIT, MROM, 10MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 | 8-BIT, MROM, 10MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 | 8-BIT, MROM, 10MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 |
| 包装说明 | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | NO | NO | NO | NO | NO |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| I/O 线路数量 | 40 | 40 | 40 | 40 | 40 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 速度 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
模拟与混合信号
PCB设计
测试/测量
嵌入式系统
ARM技术
FPGA/CPLD
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