CD54HC4052H
| 参数名称 | 属性值 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 最大通态电阻 (Ron) | 270 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装等效代码 | DIE OR CHIP |
| 电源 | 2/6,GND/-6 V |
| 认证状态 | Not Qualified |
| 最大信号电流 | 0.025 A |
| 最大供电电流 (Isup) | 0.32 mA |
| 最长接通时间 | 65 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| Base Number Matches | 1 |
| CD54HC4052H | CD54HC4051H | CD54HCT4051H | CD54HCT4052F | CD54HCT4053F | CD54HCT4051F | CD54HC4052F | CD54HC4053F | 5962-01-318-3767 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | CD54HC4052H | CD54HC4051H | CD54HCT4051H | IC,ANALOG MUX,SINGLE,4-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC | CD54HCT4053F | IC,ANALOG MUX,SINGLE,8-CHANNEL,HCT-CMOS,DIP,16PIN,CERAMIC | DIFFERENTIAL MULTIPLEXER | SGL ENDED MULTIPLEXER | IC,ANALOG MUX,SINGLE,4-CHANNEL,HC-CMOS,DIP,16PIN,CERAMIC |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 信道数量 | 4 | 8 | 8 | 4 | 2 | 8 | 4 | 2 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 3 | 1 | 1 | 3 | 1 |
| 最大通态电阻 (Ron) | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω | 270 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装等效代码 | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 电源 | 2/6,GND/-6 V | 2/6,GND/-6 V | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V | 5,GND/-5 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 2/6,GND/-6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大信号电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
| 最长接通时间 | 65 ns | 45 ns | 55 ns | 70 ns | 48 ns | 55 ns | 65 ns | 44 ns | 65 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - | - | - | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - |
| 最大供电电流 (Isup) | 0.32 mA | 0.32 mA | 0.32 mA | 0.32 mA | 0.32 mA | 0.32 mA | - | - | - |
| 厂商名称 | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 是否Rohs认证 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | - | - | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| JESD-30 代码 | - | - | - | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609代码 | - | - | - | e0 | e0 | e0 | e0 | e0 | - |
| 端子数量 | - | - | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 封装主体材料 | - | - | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | - | - | - | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | - | - | - | NO | NO | NO | NO | NO | NO |
| 端子面层 | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | - | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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