Standard SRAM, 256KX1, 35ns, CMOS, CQCC28, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| 最长访问时间 | 35 ns |
| 其他特性 | AUTOMATIC POWER-DOWN |
| JESD-30 代码 | R-CQCC-N28 |
| 长度 | 13.97 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX1 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| CY7C197-35LC | CY7C197-45LC | CY7C197-35DC | CY7C197-12DC | CY7C197-12LC | CY7C197-15LC | CY7C197-25DC | CY7C197-25LC | CY7C197-45DC | CY7C197-25KMB | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX1, 35ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256KX1, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256KX1, 35ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Standard SRAM, 256KX1, 12ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Standard SRAM, 256KX1, 12ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256KX1, 15ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256KX1, 25ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Standard SRAM, 256KX1, 25ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 256KX1, 45ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Standard SRAM, 256KX1, 25ns, CMOS, CDFP24, CERPACK-24 |
| 包装说明 | QCCN, | QCCN, | DIP, | DIP, | QCCN, | QCCN, | DIP, | QCCN, | DIP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 35 ns | 45 ns | 35 ns | 12 ns | 12 ns | 15 ns | 25 ns | 25 ns | 45 ns | 25 ns |
| 其他特性 | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
| JESD-30 代码 | R-CQCC-N28 | R-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-CQCC-N28 | R-CQCC-N28 | R-GDIP-T24 | R-CQCC-N28 | R-GDIP-T24 | R-GDFP-F24 |
| 长度 | 13.97 mm | 13.97 mm | 31.877 mm | 31.877 mm | 13.97 mm | 13.97 mm | 31.877 mm | 13.97 mm | 31.877 mm | 15.367 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 24 | 24 | 28 | 28 | 24 | 28 | 24 | 24 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | QCCN | DIP | DIP | QCCN | QCCN | DIP | QCCN | DIP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 座面最大高度 | 1.905 mm | 1.905 mm | 5.08 mm | 5.08 mm | 1.905 mm | 1.905 mm | 5.08 mm | 1.905 mm | 5.08 mm | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm | 9.652 mm |
| 厂商名称 | - | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved