Ball / Land Grid Array Sockets
Screw Lock Type
EP patents 0829188, 0897655
US patents 6190181, 6249440
Patented in other countries.
E-tec is now the leading BGA socket manufacturer.
Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following
pages. Many more exist and your exact requirements can easily be added to our extensive product
library. The SMT socket is simply placed and reflowed onto the PCB in the same way as the chip and
occupies only a small amount of additional board space. The 1.27mm pitch screw lock socket extends
≈
6,00 mm beyond the outer ball row with no fixing holes.
We aim to solve your requirements - many different terminals and configurations are available.
Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
SMT Style
Important Note:
Please check the ball diameters & heights of your chip prior to
ordering the standard E-tec BGA (BPW/BCW) sockets. Any deviation
has to be communicated to E-tec in order to check compatibility with
the standard socket design and if necessary to obtain a special order
code adapted to your chip dimensions.
The standard solderball diameters & heights are the following:
Pitch
0.50mm
0.65mm
0.75mm & 0.80mm
1.00mm
Ø 0,70mm/.028“ if pitch 1,27mm
Ø 0,60mm/.023“ if pitch 1,00mm
Ø 0,50mm/.019“ if pitch 0,80mm
Ø 0,30mm/.012“ if pitch 0,50mm
dimensions if BGA Socket pitch 1,27mm with contact type 30
Coplanarity 0,10mm/.004”
PCB Pad Layout
ball
diameters
min/max
0.25mm / 0.35mm
0.25mm / 0.50mm
0.40mm / 0.55mm
0.50mm / 0.70mm
ball
height
min/max
0.15mm / 0.30mm
0.15mm / 0.30mm
0.25mm / 0.45mm
0.30mm / 0.50mm
0.50mm / 0.70mm
0.80mm / 1.00mm
1.27mm & 1.50mm
a) plastic chips (BPW)
0.60mm / 1.00mm
b) ceramic chips (BCW) 0.60mm / 1.00mm
Specifications
Soldertail Style
Mechanical data
Soldertail:
Ø 0,45mm/.017”
Ø 0,29mm/.011”
Ø 0,29mm/.011”
Ø 0,25mm/.010”
if pitch 1,27mm
if pitch 1,00mm
if pitch 0,80mm
if pitch 0,50mm
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
10.000 cycles min.
1.000 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
up to 800 pins = 7cN per meter or 10 oz per inch
as of 800 pins = 7cN to 10cN per meter or 10 oz
to 14 oz per inch
Glass Epoxy FR 4
Brass
BeCu
Material
PCB Hole Layout
PCB solder hole:
Ø 0,60mm/.024”
Ø 0,50mm/.020”
Ø 0,40mm/.016”
Ø 0,35mm/.014”
if pitch 1,27mm
if pitch 1,00mm
if pitch 0,80mm
if pitch 0,50mm
Insulator
Terminal
Contact
Electrical data
Contact resistance
< 100 m
Ω
Current rating
500 mA max.
Insulation resistance at 500V DC 100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards
500V min.
Breakdown voltage at 60 Hz
< 1 pF
Capacitance
< 2 nH
Inductance
Operating temperature
Torque limiting screw driver
Solder paste
Solder profile
−55°C
to
+130°C
; 220°C for 10 sec.
Recommendations
The pitch dimension depends on your Ball Grid Array
Refer to page “Tools” of this catalog
Please use a solderpaste w/o any silver!
Please refer to our website www.e-tec.ch
X X W xxxx - xx xx - xx XX xx
How to order
Device Type
B
= Ball Grid
L
= Land Grid
C
= Column Grid
Device Material
C
P
= Ceramic
= Plastic
05
06
07
08
=
=
=
=
Pitch
0,50mm
0,65mm
0,75mm
0,80mm
10
= 1,00mm
12
= 1,27mm
15
= 1,50mm
Grid Code Config Code
please refer to
the footprint
pages
38 to 45
will be given by
the factory after
receipt of the
chip datasheet
Plating
01
= tin/gold
Nbr of contacts
please refer to the
footprint pages
38 to 45
30
29
28
70
65
=
=
=
=
=
Contact Type
standard SMT…
( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm, 0.60 if 0,80mm pitch; 0,40mm if 0,50mm pitch )
raised SMT….....
( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm; 2,80mm if 0,80mm pitch, 2.30mm if 0.50mm pitch )
special raised SMT - only for 1.00 & 0.80mm pitch….....
( „A“ = 4,50mm )
standard solder tail………...….
( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if 0.50mm pitch )
special short solder tail - only for 1,27mm pitch………...
( „A“ = 2,80mm )
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