Datasheet> 器件分类 > 分立半导体> 晶体管> BDS16SMD

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BDS16SMD: 产品描述8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN; 产品类别分立半导体晶体管; 文件大小21KB，共2页; 制造商SEMELAB

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BDS16SMD概述

8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN

BDS16SMD规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
零件包装代码	TO-276AB
包装说明	CHIP CARRIER, R-CBCC-N3
针数	3
Reach Compliance Code	compliant
ECCN代码	EAR99
其他特性	HIGH RELIABILITY
外壳连接	COLLECTOR
最大集电极电流 (IC)	8 A
集电极-发射极最大电压	120 V
配置	SINGLE
最小直流电流增益 (hFE)	15
JEDEC-95代码	TO-276AB
JESD-30 代码	R-CBCC-N3
元件数量	1
端子数量	3
最高工作温度	200 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装形状	RECTANGULAR
封装形式	CHIP CARRIER
峰值回流温度（摄氏度）	NOT SPECIFIED
极性/信道类型	NPN
认证状态	Not Qualified
表面贴装	YES
端子形式	NO LEAD
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
晶体管应用	SWITCHING
晶体管元件材料	SILICON
标称过渡频率 (fT)	30 MHz
Base Number Matches	1

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BDS16 BDS16SMD

BDS17 BDS17SMD

MECHANICAL DATA

Dimensions in mm

1 0.6

0.8

4.6

16.5

3.6

Dia.

1 3 .5

1 0 .6

SILICON NPN

EPITAXIAL BASE

IN TO220 METAL AND

SMD1 CERAMIC SURFACE

MOUNT PACKAGES

FEATURES

1 23

1 3 .7 0

1.0

2 .5 4

BSC

0 .8 9

(0 .0 3 5 )

m in .

3 .7 0 (0 .1 4 6 )

3 .4 1 (0 .1 3 4 )

4 .1 4 (0 .1 6 3 )

3 .8 4 (0 .1 5 1 )

2. 70

BSC

•

HERMETIC METAL OR CERAMIC PACKAGES

HIGH RELIABILITY

MILITARY AND SPACE OPTIONS

SCREENING TO CECC LEVELS

FULLY ISOLATED (METAL VERSION)

3 .6 0 (0 .1 4 2 )

M a x .

0 .7 6

(0 .0 3 0 )

m in .

APPLICATIONS

1 6 .0 2 (0 .6 3 1 )

1 5 .7 3 (0 .6 1 9 )

1 0 .6 9 (0 .4 2 1 )

1 0 .3 9 (0 .4 0 9 )

• POWER LINEAR AND SWITCHING

APPLICATIONS

• GENERAL PURPOSE POWER

9 .6

9 .3

1 1 .5

1 1 .2

7 (0

8 (0

.3 8

.3 6

.4 5

.4 4

1 )

9 )

6 )

4 )

0 .5 0 (0 .0 2 0 )

0 .2 6 (0 .0 1 0 )

TO220M

SMD1

Pin 1

– Base

- TO220 Metal Package - Isolated

- Ceramic Surface Mount Package

Pin 2

– Collector

Pin 3

– Emitter

ABSOLUTE MAXIMUM RATINGS

case

=25°C unless otherwise stated)

CBO

CEO

EBO

, I

tot

stg

Semelab plc.

Collector - Base voltage (I

= 0)

Collector - Emitter voltage (I

= 0)

Emitter - Base voltage (I

= 0)

Emitter , Collector current

Base current

Total power dissipation at T

case

75°C

Storage Temperature

Junction Temperature

Telephone +44(0)1455 556565. Fax +44(0)1455 552612.

E-mail:

sales@semelab.co.uk

Website:

http://www.semelab.co.uk

BDS16

120V

BDS17

150V

50W

–65 TO 200°C

200°C

Prelim. 7/00

BDS16SMD相似产品对比

	BDS16SMD	BDS17SMD	BDS16	BDS17
描述	8A, 120V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN	8A, 150V, NPN, Si, POWER TRANSISTOR, TO-276AB, CERAMIC, SMD1, 3 PIN	8A, 120V, NPN, Si, POWER TRANSISTOR, HERMETIC SEALED, METAL, TO-220M, 3 PIN	8A, 150V, NPN, Si, POWER TRANSISTOR, HERMETIC SEALED, METAL, TO-220M, 3 PIN
是否无铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合
零件包装代码	TO-276AB	TO-276AB	TO-220M	TO-220M
包装说明	CHIP CARRIER, R-CBCC-N3	CHIP CARRIER, R-CBCC-N3	FLANGE MOUNT, S-MSFM-P3	FLANGE MOUNT, S-MSFM-P3
针数	3	3	3	3
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99
其他特性	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY
外壳连接	COLLECTOR	COLLECTOR	ISOLATED	ISOLATED
最大集电极电流 (IC)	8 A	8 A	8 A	8 A
集电极-发射极最大电压	120 V	150 V	120 V	150 V
配置	SINGLE	SINGLE	SINGLE	SINGLE
最小直流电流增益 (hFE)	15	15	15	15
JESD-30 代码	R-CBCC-N3	R-CBCC-N3	S-MSFM-P3	S-MSFM-P3
元件数量	1	1	1	1
端子数量	3	3	3	3
最高工作温度	200 °C	200 °C	200 °C	200 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	METAL	METAL
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
封装形式	CHIP CARRIER	CHIP CARRIER	FLANGE MOUNT	FLANGE MOUNT
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
极性/信道类型	NPN	NPN	NPN	NPN
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	NO	NO
端子形式	NO LEAD	NO LEAD	PIN/PEG	PIN/PEG
端子位置	BOTTOM	BOTTOM	SINGLE	SINGLE
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
晶体管应用	SWITCHING	SWITCHING	SWITCHING	SWITCHING
晶体管元件材料	SILICON	SILICON	SILICON	SILICON
标称过渡频率 (fT)	30 MHz	30 MHz	30 MHz	30 MHz

BDS16SMD

BDS16SMD概述

BDS16SMD规格参数

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