SMC62B81F13概述

IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC

SMC62B81F13规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	QFP
包装说明	QFP, QFP64,.47SQ,20
针数	64
Reach Compliance Code	compliant
位大小	4
CPU系列	E0C6200/SMC6200
JESD-30 代码	S-PQFP-G64
JESD-609代码	e0
负电源额定电压	-1.5 V
端子数量	64
最高工作温度	70 °C
最低工作温度	-20 °C
封装主体材料	PLASTIC/EPOXY
封装代码	QFP
封装等效代码	QFP64,.47SQ,20
封装形状	SQUARE
封装形式	FLATPACK
电源	-1.5 V
认证状态	Not Qualified
RAM（字节）	48
ROM（单词）	1024
ROM可编程性	MROM
最大压摆率	0.025 mA
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
Base Number Matches	1

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SMC62B81F13相似产品对比

	SMC62B81F13	SMC62L81F6	SMC62L81F13	SMC62A81F6	SMC62A81F13	SMC62B81F6	SMC6281F13	SMC6281F6
描述	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	QFP, QFP64,.47SQ,20	LQFP, QFP64,.66SQ,32	LFQFP, QFP64,.47SQ,20	QFP, QFP64,.66SQ,32	QFP, QFP64,.47SQ,20	QFP, QFP64,.66SQ,32	LFQFP, QFP64,.47SQ,20	LQFP, QFP64,.66SQ,32
针数	64	64	64	64	64	64	64	64
Reach Compliance Code	compliant	compliant	unknown	unknown	compliant	compliant	compliant	compliant
位大小	4	4	4	4	4	4	4	4
CPU系列	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200
JESD-30 代码	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
负电源额定电压	-1.5 V	-1.5 V	-1.5 V	-3 V	-3 V	-1.5 V	-3 V	-3 V
端子数量	64	64	64	64	64	64	64	64
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
最低工作温度	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QFP	LQFP	LFQFP	QFP	QFP	QFP	LFQFP	LQFP
封装等效代码	QFP64,.47SQ,20	QFP64,.66SQ,32	QFP64,.47SQ,20	QFP64,.66SQ,32	QFP64,.47SQ,20	QFP64,.66SQ,32	QFP64,.47SQ,20	QFP64,.66SQ,32
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE
电源	-1.5 V	-1.5 V	-1.5 V	-3 V	-3 V	-1.5 V	-3 V	-3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	48	48	48	48	48	48	48	48
ROM（单词）	1024	1024	1024	1024	1024	1024	1024	1024
ROM可编程性	MROM	MROM	MROM	MROM	MROM	MROM	MROM	MROM
最大压摆率	0.025 mA	0.01 mA	0.01 mA	0.025 mA	0.025 mA	0.025 mA	0.01 mA	0.01 mA
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULLWING	GULLWING	GULL WING	GULL WING	GULL WING	GULLWING	GULLWING
端子节距	0.5 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
是否Rohs认证	不符合	不符合	-	-	不符合	不符合	不符合	不符合
Base Number Matches	1	1	1	1	1	1	-	-

SMC62B81F13

SMC62B81F13概述

SMC62B81F13规格参数

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