IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Seiko Epson Corporation |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, QFP64,.66SQ,32 |
| 针数 | 64 |
| Reach Compliance Code | compliant |
| 具有ADC | NO |
| 地址总线宽度 | 8 |
| 位大小 | 4 |
| CPU系列 | E0C6200/SMC6200 |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 4 |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 负电源额定电压 | -1.5 V |
| I/O 线路数量 | 4 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP64,.66SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 电源 | -1.5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 48 |
| ROM（单词） | 1024 |
| ROM可编程性 | MROM |
| 最大压摆率 | 0.01 mA |
| 最大供电电压 | 3.5 V |
| 最小供电电压 | 0.9 V |
| 标称供电电压 | 1.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULLWING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| SMC62L81F6 | SMC62L81F13 | SMC62A81F6 | SMC62A81F13 | SMC62B81F13 | SMC62B81F6 | SMC6281F13 | SMC6281F6 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | LQFP, QFP64,.66SQ,32 | LFQFP, QFP64,.47SQ,20 | QFP, QFP64,.66SQ,32 | QFP, QFP64,.47SQ,20 | QFP, QFP64,.47SQ,20 | QFP, QFP64,.66SQ,32 | LFQFP, QFP64,.47SQ,20 | LQFP, QFP64,.66SQ,32 |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | compliant | unknown | unknown | compliant | compliant | compliant | compliant | compliant |
| 位大小 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| CPU系列 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负电源额定电压 | -1.5 V | -1.5 V | -3 V | -3 V | -1.5 V | -1.5 V | -3 V | -3 V |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LFQFP | QFP | QFP | QFP | QFP | LFQFP | LQFP |
| 封装等效代码 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.66SQ,32 | QFP64,.47SQ,20 | QFP64,.66SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE |
| 电源 | -1.5 V | -1.5 V | -3 V | -3 V | -1.5 V | -1.5 V | -3 V | -3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| ROM（单词） | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 最大压摆率 | 0.01 mA | 0.01 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.01 mA | 0.01 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULLWING | GULLWING | GULL WING | GULL WING | GULL WING | GULL WING | GULLWING | GULLWING |
| 端子节距 | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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