Flash, 512X8, PDIP8,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | unknown |
| 最大时钟频率 (fCLK) | 1 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 端子数量 | 8 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 电源 | 2/5.5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 类型 | NOR TYPE |
| 写保护 | SOFTWARE |
| Base Number Matches | 1 |
| X76F400PI-2.0 | X76F400YI2.0 | X76F400Y2.0 | X76F400S8I-2.0 | X76F400S8-2.0 | X76F400P-2.0 | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 512X8, PDIP8, | Flash Memory, | Flash Memory, | Flash, 512X8, PDSO8, | Flash, 512X8, PDSO8, | Flash, 512X8, PDIP8, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 最大时钟频率 (fCLK) | 1 MHz | - | - | 1 MHz | 1 MHz | 1 MHz |
| 数据保留时间-最小值 | 100 | - | - | 100 | 100 | 100 |
| 耐久性 | 100000 Write/Erase Cycles | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T8 | - | - | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 |
| 内存密度 | 4096 bit | - | - | 4096 bit | 4096 bit | 4096 bi |
| 内存集成电路类型 | FLASH | - | - | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | - | - | 8 | 8 | 8 |
| 端子数量 | 8 | - | - | 8 | 8 | 8 |
| 字数 | 512 words | - | - | 512 words | 512 words | 512 words |
| 字数代码 | 512 | - | - | 512 | 512 | 512 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 70 °C | 70 °C |
| 组织 | 512X8 | - | - | 512X8 | 512X8 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | - | SOP | SOP | DIP |
| 封装等效代码 | DIP8,.3 | - | - | SOP8,.25 | SOP8,.25 | DIP8,.3 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | SERIAL | - | - | SERIAL | SERIAL | SERIAL |
| 电源 | 2/5.5 V | - | - | 2/5.5 V | 2/5.5 V | 2/5.5 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.000001 A | - | - | 0.000001 A | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.003 mA | - | - | 0.003 mA | 0.003 mA | 0.003 mA |
| 表面贴装 | NO | - | - | YES | YES | NO |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | - | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL |
| 类型 | NOR TYPE | - | - | NOR TYPE | NOR TYPE | NOR TYPE |
| 写保护 | SOFTWARE | - | - | SOFTWARE | SOFTWARE | SOFTWARE |
| 厂商名称 | - | - | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
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