Standard SRAM, 64KX16, 35ns, CMOS, PDSO44, TSOP2-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | TSOP2 |
包装说明 | SOP, TSOP44,.46,32 |
针数 | 44 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 35 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 64KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | TSOP44,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
电源 | 3.3 V |
认证状态 | Not Qualified |
最大待机电流 | 4e-7 A |
最小待机电流 | 1.5 V |
最大压摆率 | 0.04 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
AS7C31026LL-35TC | AS7C31026LL-35BC | AS7C31026LL-70TC | AS7C31026LL-55TC | AS7C31026LL-100TC | AS7C31026LL-55BC | AS7C31026LL-70BI | AS7C31026LL-35BI | AS7C31026LL-35TI | |
---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 64KX16, 35ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 35ns, CMOS, PBGA48, 8 X 6 MM, 0.75 MM PITCH, CSP, BGA-48 | Standard SRAM, 64KX16, 70ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 100ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 55ns, CMOS, PBGA48, 8 X 6 MM, 0.75 MM PITCH, CSP, BGA-48 | Standard SRAM, 64KX16, 70ns, CMOS, PBGA48, 8 X 6 MM, 0.75 MM PITCH, CSP, BGA-48 | Standard SRAM, 64KX16, 35ns, CMOS, PBGA48, 8 X 6 MM, 0.75 MM PITCH, CSP, BGA-48 | Standard SRAM, 64KX16, 35ns, CMOS, PDSO44, TSOP2-44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP2 | BGA | TSOP2 | TSOP2 | TSOP2 | BGA | BGA | BGA | TSOP2 |
包装说明 | SOP, TSOP44,.46,32 | BGA, BGA48,6X8,30 | SOP, TSOP44,.46,32 | SOP, TSOP44,.46,32 | SOP, TSOP44,.46,32 | BGA, BGA48,6X8,30 | BGA, BGA48,6X8,30 | BGA, BGA48,6X8,30 | SOP, TSOP44,.46,32 |
针数 | 44 | 48 | 44 | 44 | 44 | 48 | 48 | 48 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 35 ns | 35 ns | 70 ns | 55 ns | 100 ns | 55 ns | 70 ns | - | 35 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON |
JESD-30 代码 | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PBGA-B48 | R-PBGA-B48 | - | R-PDSO-G44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | - | 1048576 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
端子数量 | 44 | 48 | 44 | 44 | 44 | 48 | 48 | - | 44 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | - | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | - | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | - | 85 °C |
组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | - | 64KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | SOP | BGA | SOP | SOP | SOP | BGA | BGA | - | SOP |
封装等效代码 | TSOP44,.46,32 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 | - | TSOP44,.46,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE | GRID ARRAY | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | GRID ARRAY | GRID ARRAY | - | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
峰值回流温度(摄氏度) | 240 | NOT SPECIFIED | 240 | 240 | 240 | NOT SPECIFIED | NOT SPECIFIED | - | 240 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
最大待机电流 | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | 4e-7 A | - | 4e-7 A |
最小待机电流 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | - | 1.5 V |
最大压摆率 | 0.04 mA | 0.04 mA | 0.03 mA | 0.035 mA | 0.025 mA | 0.035 mA | 0.03 mA | - | 0.04 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | BALL | GULL WING | GULL WING | GULL WING | BALL | BALL | - | GULL WING |
端子节距 | 0.8 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.75 mm | - | 0.8 mm |
端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | - | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
厂商名称 | - | - | - | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
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