Power Management Circuit, PQCC32,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | compliant |
JESD-30 代码 | S-PQCC-N32 |
JESD-609代码 | e0 |
端子数量 | 32 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCN |
封装等效代码 | LCC32,.2SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5,12 V |
认证状态 | Not Qualified |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
APW7066QAC-TY | APW7066QAC-TUL | APW7066RC-TUL | APW7066QAC-TYL | APW7066QAC-TR | |
---|---|---|---|---|---|
描述 | Power Management Circuit, PQCC32, | Power Management Circuit, PQCC32, | Power Management Circuit, PDSO24, | Power Management Circuit, PQCC32, | Power Management Circuit, PQCC32, |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | R-PDSO-G24 | S-PQCC-N32 | S-PQCC-N32 |
端子数量 | 32 | 32 | 24 | 32 | 32 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCN | QCCN | TSSOP | QCCN | QCCN |
封装等效代码 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | TSSOP24,.25 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | CHIP CARRIER |
电源 | 5,12 V | 5,12 V | 5,12 V | 5,12 V | 5,12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | DUAL | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
包装说明 | - | QCCN, LCC32,.2SQ,20 | TSSOP, TSSOP24,.25 | QCCN, LCC32,.2SQ,20 | - |
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